Toradex Announce Price Reductions of Robin Computer on Module Family

Toradex are pleased to announce reductions of between 12% and 16% across their Robin computer on module family.

Horw, Switzerland March 21, 2013

Toradex are pleased to announce reductions of between 12% and 16% across their Robin computer on module family. The reductions will take effect as of today. The Robin modules have a guaranteed minimum availability and support from Toradex until the year 2017.

Robin modules start at €121.00/145 CHF/$169 US/CN¥1,089.00/ ₹9,500.00 for the Z510 S model.

The credit card sized Robin Z530 and Z510 are embedded Nano COM Express™ Type 1 computer on modules. They are based on Intel® Atom™ Z530 and Z510 processors and the Intel® System Controller Hub US15W. This combines the memory controller, graphic engine and I/O in a single, ultra compact design. The Intel® Atom™ Z530 processor runs at 1.6GHz and is designed for high performance computing with low power consumption. Robin Z510 features the Intel® Atom™ Z510 processor which runs at 1.1GHz.

To take advantage of this price reduction, visit the Toradex web shop at today.

About Toradex

Founded in Switzerland, today the Toradex network stretches across the world. Its direct sales model and local service approach puts Toradex in regular contact with more than 3,000 customers around the globe. Toradex supplies embedded computer modules for demanding applications and offers premium support service to help its customers rapidly bring product to market. Toradex's strategic vision and long term orientation makes it the company of choice for ambitious and creative people.
Toradex products are deployed within a diverse range of markets and industries. Typical industries include: automotive, medical devices, laboratory equipment, point of sales, gaming machines, navigation systems, musical instruments, machine control, virtual reality simulation, digital signage, traffic control systems, building automation, security systems, robotics, process control and auto pilots.

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DESIGN West/ESC Silicon Valley, San Jose, USA, April 22-25, 2013
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IPC&EMBEDDED EXPO 2013, ShenZhen, China, August 1-3, 2013
DESIGN East/ESC Boston, USA, September 30 - October 3, 2013

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