VadaTech Announces Rugged Conduction-Cooled MicroTCA Ecosystem

VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has released a complete ecosystem of boards and chassis in the compact MicroTCA architecture that is conduction-cooled.

VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has released a complete ecosystem of boards and chassis in the MicroTCA architecture that is conduction-cooled. Designed for rugged applications, the products are utilized in Robotics, Mil/Aero, Rugged/Mobile and other applications that require a small form factor. The VadaTech line includes Air Transport Racks (ATR), MicroTCA Carrier Hubs (MCH), Power Modules, and Advanced Mezzanine Cards.


Compliant to MicroTCA.3 (Hardened Conduction-Cooled MicroTCA) specification, the boards and chassis come in various sizes and formats. The MCH, which acts as a shelf controller, features a 400 MHz RISC CPU for high performance and low latency. The Power Modules provide true hot-swappability in a dual 10-36V input and outputs of up to 800W. They also have dual Intelligent Platform Management Interface (IPMI) and two banks of 256K Flash for redundancy. Several of VadaTech's Advanced Mezzanine Cards (AMCs) are in the conduction-cooled format. The company is also able to modify standard AMCs to ruggedized versions with wedge locks.

The VadaTech ATRs come in ½ and ¾ short sizes with long and tall versions also offered. Customized chassis and module solutions are available.

In addition to MicroTCA.3 conduction-cooled solutions, VadaTech offers the full range of MicroTCA processors, graphics/IO, carriers, JSMs, Power Modules, MCHs, NICs, storage, enclosures, and more in MicroTCA.0/.1/.2 air-cooled versions. The company also provides the full ecosystem of MicroTCA.4 (with Rear IO) for High-Energy Physics and other applications.

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