Additive Manufacturing/3D Printing Advancements Spotlighted at Chicago Event

RadTech, the non profit for the advancement of UV technologies is sponsoring a unique Additive Manufacturing/3d Printing conference.

Bethesda, MD - April 14, 2014 - Photopolymer Additive Manufacturing/3D

Printing technology creates complex three dimensional structures from
digital data by successively curing a liquid resin by exposure to
ultraviolet light. The technology is widely used for model verification,
functional testing, and the direct manufacture of parts due to its accuracy,
speed and process versatility. It serves many industries including service
bureaus, consumer products, automotive, medical/dental, electronics,
motorsports, aerospace, architectural, as well as academic and
government/military applications.

A unique conference dedicated to advancements in ultraviolet (UV) processing
materials and technology is scheduled for May 12-14 in Chicago. The
conference will review the history of photopolymers in Additive
Manufacturing/3D Printing, describe the physical properties of liquid and
cured UV formulations; introduce emerging innovations and materials; and
discuss current applications and the exciting potential for future uses. UV
curable formulations are uniquely suited for use in additive
manufacturing/3D Printing due to their near instantaneous cure, range of
properties, and dimensional accuracy.

The event will also spotlight Design Enabled by UV + EB Technology, with a
session on Empowering Design & Product Development with Additive
Manufacturing; and a special presentation by the President of Made Boards,
developers of clean, customizable windsurfing, kitesurfing and paddle
boards, to discuss his groundbreaking work in the application of Additive
Manufacturing/3D Printing. RadTech, the non-profit trade association
dedicated to ultraviolet and electron beam (EB) technologies is sponsoring
the cutting edge event, featuring conference programming, short courses and
exhibits: RadTech 2014, Chicago/Rosemont, May 12-14,
http://www.radtech2014.com. The overall UV/EB conference features over 100
speakers including from companies such as Boeing, Nestle, Conforming Matrix,
JMC Steel Group, Motorola, American Trim, Helios, Idex, and many more. For
more information, please visit http://www.radtech2014.com.

Featured Product

BitFlow Introduces 6th Generation Camera Link Frame Grabber: The Axion

BitFlow Introduces 6th Generation Camera Link Frame Grabber: The Axion

BitFlow has offered a Camera Link frame grabbers for almost 15 years. This latest offering, our 6th generation combines the power of CoaXPress with the requirements of Camera Link 2.0. Enabling a single or two camera system to operate at up to 850 MB/S per camera, the Axion-CL family is the best choice for CL frame grabber. Like the Cyton-CXP frame grabber, the Axion-CL leverages features such as the new StreamSync system, a highly optimized DMA engine, and expanded I/O capabilities that provide unprecedented flexibility in routing. There are two options available; Axion 1xE & Axion 2xE. The Axion 1xE is compatible with one base, medium, full or 80-bit camera offering PoCL, Power over Camera Link, on both connectors. The Axion 2xE is compatible with two base, medium, full or 80-bit cameras offering PoCL on both connectors for both cameras. The Axion-CL is a culmination of the continuous improvements and updates BitFlow has made to Camera Link frame grabbers.