Event brings together thousands to experience the journey to The Connected Enterprise
Autodesk to Feature Spark Open Software Platform at MecklerMedia's Inside 3D Printing in Santa Clara- Get 10% OFF!
Visit www.inside3dprinting.com/santa-clara for further information
New tool helps engineers modify standard API Technologies' RF/Microwave products
New M290 3D Metal Printer on Track for Installation and Commencement of Production; Company Receives Request for Quotes
Phoenix Aerial Systems introduces two game changing UAV LiDAR products: the Scout, a lightweight low-cost mapping system, and the Ranger, a survey grade long range system featuring the Riegl VUX-1 sensor.
Festo Hosts Two Day Event to Promote the Importance of Manufacturing to the United States
Paired with TURCK's BL ident platform, the new Q120 product creates an all-in-one RFID solution
Neah Power Partners with Silent Falcon to Integrate Fuel Cells into Unmanned Aerial Vehicles (UAV) Formira hydrogen-on-demand technology expected to increase mission endurance and enable heavier payloads.
The fuel cell could significantly increase the mission endurance by between two times to three times the current duration, as well as enable heavier payloads.
Pack Expo - Microscan Unveils Simple, Multi-Camera Software for Packaging Inspection at PACK EXPO 2014
Microscan releases I-PAK VH Software, combining the unique mutli-camera inspection capability of the I-PAK family with the complete suite of Microscan machine vision tools available on the latest Vision HAWK Smart Cameras.
Clearpath's Kingfisher Unmanned Surface Vessel recognized as "remarkable technical accomplishment."
ALTA DEVICES ANNOUNCES COOPERATION WITH AIRWARE TO ENABLE SEAMLESS INTEGRATION OF SOLAR POWER IN SMALL UNMANNED AERIAL VEHICLES
Longer Flight Endurance Is Critical For Precision Agriculture, Search and Rescue, Land Surveying, and Many Other Commercial UAV Applications
The TALON V Robot is the first in its class to be IOP compliant as defined by the U.S. Army
See the new iLaserBox 400 Laser Marking Workstation at Pack Expo, Booth N-5406.
Pack Expo - ITT's Compact Automation Brand Highlights Hydraulic and Pneumatic Solutions at PACK EXPO 2014
ITT offers highly engineered cylinders and actuators designed for the packaging industry
Pack Expo - Tekkra Introduces at Pack Expo 2014 an Innovative Entry-Level Shrink Wrapping and Bundling System
The new, modular Triad system from Tekkra delivers rugged, dependable shrink wrapping and bundling technology at an entry-level price and breaks new ground in terms of flexibility. (Tekkra Pack Expo Booth # N-5325)
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