ATP Gears Up for Age of Autonomous Systems, Showcases iTemp NVMe™ M.2 SSDs at Embedded World 2018

Advancements in smart systems operating without direct human intervention drive increase in memory requirements

Taipei, Taiwan (February 2018) - ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, unveils its flagship NVMe™ solid state drive (SSD) modules with industrial temperature support at Embedded World 2018 in Nuremberg, Germany from February 27 to March 1, 2018.


ATP joins over 1000 exhibitors from 42 countries, showcasing its innovative portfolio of industrial DRAM and NAND flash storage products at Hall 1, Booth 1-561.

"Embedded World 2018's theme, ‘Embedded Goes Autonomous,' perfectly aligns with ATP's commitment to meet the increasing memory requirements of billions of connected devices becoming increasingly autonomous in this vast network called Internet of Things," said Marco Mezger, ATP Vice President of Global Marketing. He further expressed, "As a true manufacturer with over 25 years of expertise and leadership in the industrial memory market, ATP is more than ready for the growing needs of autonomous systems in automotive, biomedical, industrial, aerospace/avionics, and other mission-critical applications."

Taking the spotlight among the array of products is ATP's new NVMe M.2 2280 SSDs with a wide operating temperature range of -40°C to 85°C. These lean but feature-rich SSD modules perform reliably in any harsh environment where temperatures can vary from extremely cold to hot, and are ideal for fanless embedded systems facing power and heat issues. ATP Dynamic Thermal Throttling intelligently adjusts performance to cool the system, smartly reducing heat without dramatic declines in performance.

ATP's iTemp M.2 NVMe SSDs are designed for a PCIe® Generation 3.0 x4 lane high-speed interface, delivering a bandwidth of up to 32 Gb/s (8 Gb/s per lane), which is four to six times the data transfer speed of previous-generation AHCI protocol on Serial ATA drives. With densities of up to 1 TB, Global Wear Leveling, and TRIM support on the latest Windows® and Linux operating systems, these SSDs are ready for the data-intensive age of autonomous embedded systems.

Other industrial-grade products on display are fast, low-power DDR4-2666 DRAM modules for the latest Intel® Xeon® Scalable and 8th-generation Intel® Core™ i7/i5/i3 processors; highly reliable memory cards for automotive applications requiring high levels of data accuracy, consistency and integrity; and, Serial ATA 6Gb/s SSDs with wide temperature support delivering packed and cost-effective performance in lean footprints.

All ATP products are designed, thoroughly tested and manufactured in its purpose-built factory. Visit the ATP booth at Hall 1, Booth 1-561.

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