Colibri T30 Computer on Module from Toradex - Shipping 1st Jan 2013!

Toradex have announced that their new product, the Colibri T30 ARM Computer on Module, will be shipping from the 1st January 2013.

Horw, Switzerland December 19, 2012

Toradex have announced that their new product, the Colibri T30 ARM Computer on Module, will be shipping from the 1st January 2013.

The Colibri T30 is based on an NVIDIA® Tegra™ 3 Quad-Core Cortex-A9 MPCore processor and comes pre-installed with Embedded Linux L4T. A Windows Embedded Compact 7 version is also currently under development. The module includes 1GB DDR3 RAM (32 Bit) and 2GB eMMC FLASH memory and a wealth of industrial interfaces.

From the New Year the product will be available in sample quantities and orders can be placed now through the Toradex webshop. Prices will start at €89.00/ $125.00 / ¥801.00. For more information about this product visit our developer website at

For more information on Toradex and its products visit

About Toradex

Founded in Switzerland, today the Toradex network stretches across the world. Its direct sales model and local service approach puts Toradex in regular contact with more than 3,000 customers around the globe. Toradex supplies embedded computer modules for demanding applications and offers premium support services to help its customers rapidly bring product to market. Toradex's strategic vision and long term orientation makes it the company of choice for ambitious and creative people.

Toradex products are deployed within a diverse range of markets and industries. Typical industries include: automotive, medical devices, laboratory equipment, point of sales, gaming machines, navigation systems, musical instruments, machine control, virtual reality simulation, digital signage, traffic control systems, building automation, security systems, robotics, process control and auto pilots.

Swiss. Embedded. Computing.

Meet the Toradex engineers at:
Vision Summit, Bangalore, India, February 14-15 2013
EFY EXPO, Delhi, India, February 21-23 2013
Embedded World, Nuremberg, Germany, February 26-28, 2013
DESIGN West/ESC Silicon Valley, San Jose, USA, April 22-25, 2013
IPC&EMBEDDED EXPO 2013, ShenZhen, China, August 1-3, 2013
DESIGN East/ESC Boston, USA, September 30-October 3, 2013

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