New Dual Wideband Transceiver from VadaTech in FMC Format

VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has announced a dual wideband transceiver in the FPGA Mezzanine Card (FMC) format. The board has a frequency range of 70 MHz to 6 GHz and is ideal for LTE, SDR, and other advanced RF applications.

Microscan Offers Advanced Optical Character Recognition for Machine Vision with New IntelliText OCR Tool

Microscan, a global technology leader in barcode, machine vision, and lighting solutions, announces the latest innovation from its award-winning AutoVISION® machine vision suite: IntelliText OCR. Teach your machines to read rotated, damaged, or low-contrast text. Get more intelligent text recognition on parts and packages. Adapt to any print, lighting, or surface condition with IntelliText OCR.

IAR Systems Enables Development for Low-Power Sensor Processing Based on New NXP Dual-Core Series

IAR Embedded Workbench is the ultimate choice for always-on sensor applications for the Internet of Things along with the LPC54100 series

Rapid Prototyping Kit Simplifies Wide-Dynamic-Range GSPS Data Converter-to-FPGA Connectivity

Kit contains hardware and software to rapidly move from prototype to production with FPGA platforms including Xilinx Ultrascale and Zynq

Sierra-Olympic Introduces Affordable, Convenient, Uncooled Infrared (IR) Camera for Industrial & Research Apps

New Camera Link® Viento 320 thermal camera is now available online.

Patented DPFlex II Sensorless Brushless Drive Exceeds Performance of Hall-Based Drives

Allied Motion's innovative new DPFlex II sensorless brushless drive hits market

Kickstarter - Hardcotton's Pressure Controlled SLA 3D Printer Set to Launch on Kickstarter

Hardcotton's much anticipated Kickstarter campaign for their revolutionary pressure controlled stereolithography (SLA) 3D printer is set to launch next week.

New DENSO VS-Series Aseptic Robot

Sterilizable, for Pharmaceutical, Medical and Life Sciences Applications

Functionalize Launches Kickstarter Campaign to Power Up 3D Printing With World's Most Electronically Conductive 3D Printing Filament

Scientific breakthrough F-Electric 1,000 times more electrically conductive than today's best conductive filament-Makes it possible to build electronic or electromechanical capabilities seamlessly inside 3D printed structures

Double record at VISION 2014: rise in number of exhibitors and visitors

Machine vision is increasingly international. Industry satisfied with new two-year rhythm

MORGAN ADVANCED MATERIALS EXTENDS REFLECTOR GLAZE RANGE

Developed for high-energy pulsed Q-switching infrared laser applications, a new, high-absorption samarium oxide glaze from Morgan Advanced Materials means it is now able to offer three grades of glaze for laser systems.

New 6-Slot MicroTCA.4 Chassis Features High Performance Density in 2U Height

VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers a 2U chassis platform that complies to the MicroTCA.4 specification for High Energy Physics and other applications requiring rear IO. The rear IO capability is an attractive option in many Mil/Aero, Physics, Broadcast, Energy, and Network Security designs.

Morgan Advanced Materials announces advances in their range of high purity materials for semiconductor applications

Morgan Advanced Materials announces advances in their range of materials grown using chemical vapor deposition (CVD) processes.

TURCK's New Passive Junction Boxes Simplify Device Integration

Stainless steel ports allow integration of multiple devices to a single unit, even in harsh environments

Harper Partners with University of Colorado Boulder to Engineer Cutting-Edge R&D System for Advanced Magnesium Processing

One of the most advanced customizations of the Harper system includes the hybrid utilization of both electric energy and renewable, concentrated solar power for heating.

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