ID Technology Showcases Enhancements to the #1 Selling Label Printer Applicator at Pack Expo

New high speed wipe and enhanced tamp modules raise the bar for labeling speed and quality | See them at Pack Expo Booth N-5406.

ABB to feature robotic welding and cutting innovations that simplify operation and improve quality at FABTECH 2014

Highlights include a revolutionary new robotic TIP-TIG process, standardized robotic laser cutting cells, and universal Ethernet based interfaces

Rockwell Automation to Host 23rd Annual Automation Fair Event in Anaheim

Event brings together thousands to experience the journey to The Connected Enterprise

New Piranha4 2k Quadlinear Line Scan Camera for Multispectral Imaging from Teledyne DALSA

Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, today introduced its Piranha4 2k quadlinear line scan camera featuring red, green, and blue (RGB) outputs plus a Near Infrared (NIR) channel for multispectral imaging.

Festo Celebrates National Manufacturing Day

Festo Hosts Two Day Event to Promote the Importance of Manufacturing to the United States

Midwest Engineering Systems Announces Relocation of Corporate Headquarters

Due to increased customer demand and the need for more manufacturing space, we've doubled the size of our corporate headquarters.

Schunk - Standardized RCC axes for high-speed assembly

The linear modules of SCHUNK's LCx series set a new benchmark.

Pack Expo - Microscan Unveils Simple, Multi-Camera Software for Packaging Inspection at PACK EXPO 2014

Microscan releases I-PAK VH Software, combining the unique mutli-camera inspection capability of the I-PAK family with the complete suite of Microscan machine vision tools available on the latest Vision HAWK Smart Cameras.

Pack Expo - ID Technology Introduces the New iLaserBox 400 Laser Marking Workstation at Pack Expo

See the new iLaserBox 400 Laser Marking Workstation at Pack Expo, Booth N-5406.

Pack Expo - ITT's Compact Automation Brand Highlights Hydraulic and Pneumatic Solutions at PACK EXPO 2014

ITT offers highly engineered cylinders and actuators designed for the packaging industry

Pack Expo - Tekkra Introduces at Pack Expo 2014 an Innovative Entry-Level Shrink Wrapping and Bundling System

The new, modular Triad system from Tekkra delivers rugged, dependable shrink wrapping and bundling technology at an entry-level price and breaks new ground in terms of flexibility. (Tekkra Pack Expo Booth # N-5325)

Robotic Accuracy to be Combined with Human Flexibility for Working Together

Rather than taking jobs, robots will one day soon join people on the factory floor, as co-workers and collaborators. That's the vision of a EUR 6.5 million project led by Stockholm's KTH Royal Institute of Technology.

GAM Launches New Gearbox Sizing Tool

GAM's new Sizing Tool makes it easy to find the right gear reducer, coupling, or linear mount product compatible with your motor. Simply select your motor, adjust the ratings based on the application, and narrow down the products that match.

Intelligrated appoints new executive vice president and general manager for software group

Proven global software veteran to drive enterprise-level software growth

Toshiba Imaging's New UltraHD 4K

- World's Smallest 3-Chip Video Camera

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Factory Automation - Featured Product

maxon motor’s - Compact power for your motion control application.

maxon motor's - Compact power for your motion control application.

maxon launches the next generation of positioning controllers - the EPOS4. A high performance module with detachable pin headers and two different power ratings. With a connector board, the modules can be combined into a ready-to-install compact solution. Suitable for efficient and dynamic control of brushed and brushless DC motors with Hall sensors and encoders up to 750 W continuous power and 1500 W peak power. The modular concept also provides for a wide variety of expansion options with Ethernet-based interfaces, such as EtherCAT or absolute rotary encoders.