Brooklyn-based Solidoodle permanently reduces prices on current 3D printer models and upgrades previous 2nd Generation and 3rd Generation printers with new all-metal extruder.
Midwest Engineering Systems an official KUKA Robotics System Partner will be featured in the Kuka Robotics Corporation booth and display new automation technology.
Flexible Robotics Environment, (FRE) announces the creation of VDK6000 robotic metal 3D printing and repair work cell that automates refurbishing, rebuilding and/or creation of metal components utilizing subtractive and additive technology.
PaR Systems, Inc., a world leader in aerospace manufacturing, material handling, automation, and robotic solutions since 1961, announced today that its Shoreview based Automation Solutions Business and its I-STIR Technology, in partnership with FANUC America, are revolutionizing the utilization of the Friction Stir Welding process.
Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification
Protium rapid prototyping platform features flow compatibility with Palladium platform, shortening bring-up time by up to 70 percent versus competitive solutions ----New Protium rapid prototyping platform increases capacity by 4X over the previous generation ---- Palladium XP II verification computing platform now features IEEE 1801 support for improved low-power verification
The Vinden CZ series is designed as an open-frame chassis camera for integrators and OEMs in industrial, security/surveillance, and military markets.
Switch from a handle to a drill in a snap!
More than 100 new makers to take over Henry Ford Museum for two days of unbridled creativity and fun.
Engineered, manufactured and tested for prying, chiseling and punching.
The new Spiroflow Systems gain-in-weight bulk bag filling system delivers 15x productivity increase, increases weighing accuracy over 400%, reduces number of operators from nine to one and minimizes possible product contamination.
Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent
Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry.
System features new PeakForce IR SPM Mode for Comprehensive Nanocharacterization
Stratasys expects to complete its acquisition of Harvest Technologies by the end of July.
The global 3D printing market will reach $8.6 billion by 2020, registering a CAGR of 20.6% from 2014 to 2020.
The UXX is the most powerful standard ironless motor Tecnotion offers. It is ideal for heavy duty industrial applications that demand ultra-precision and maximum force output.
Records 1801 to 1815 of 1935
Personal & Service Robots - Featured Product
Duro® is a ruggedized version of Swift Navigation's Piksi® Multi RTK GNSS receiver. Built to be tough, Duro is designed for easy integration into existing equipment. This affordable, easy-to-deploy GNSS sensor delivers robust, centimeter-accurate positioning while protected against weather, moisture, vibration, dust, water immersion and the unexpected that can occur in outdoor long-term deployments.