VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has announced a FPGA in the Advanced Mezzanine Card (AMC) form factor that utilizes the Xilinx® Zynq® all programmable SoC.
Pack Expo - Intelligrated introduces enhanced robotic mixed-load order fulfillment solutions at PACK EXPO International 2014
Next-generation robotic technology increases product-handling flexibility and load stability to satisfy mixed-load requirements
PACK EXPO International, one of the most highly regarded packaging exhibitions in the world, is held annually and features the latest innovations and trends in the processing and packaging industry.
Pack Expo - A. Schulman To Feature A Wide Range Of Integrated Solutions Serving The North American Packaging Industry At PACK EXPO International
PACK EXPO International, November 2-5, 2014, in Chicago
Discover the new Arctic Series of Palletizing Robots from KUKA Robotics in booth #N-5347 at PACK EXPO Chicago, November 1st - November 5th 2014
Pack Expo - Brother RuggedJet 4 Wi-Fi Mobile Printers to be Showcased by HighJump Software at PACK EXPO 2014
The combined solution will be demonstrated at PACK EXPO 2014, November 2-5 in Chicago's McCormick Place, Booth #9535.
DATALOGIC Presents Innovative Products and Solutions for Industrial Automation at SPS IPC Drives 2014
Datalogic will showcase bar code readers, machine vision cameras, laser markers, sensors, safety devices, as well as integrated solutions for improving efficiency and accuracy.
JBT Tackling Tough Industry Issues at PACK EXPO 2014
Pack Expo - Cambridge Engineered Solutions Highlights Innovative Conveyor Belts for Canning, Bottling and Packaging at Pack Expo
Conveyor belts operating, on display and available for sampling at Booth E-10635 at the Lakeside Lower Hall
Datalogic will feature next generation solutions in automated bar code reading and inspection, including their new P-Series smart camera, Matrix 210 Liquid Lens 2D imager, Falcon X3+ mobile computer and the PowerScan PM9500-DK handheld imager at PACK EXPO International
Special Effects Guru to Advise Company on Strategic Development
Analog Devices' Magnetic Angle Sensor Technology Delivers Industry's Highest Performance for Precision DC Motor Controls
ADI's ADA4571 sensor directly measures the shaft position in brushless DC motors, reducing noise and optimizing motor smoothness and torque in automotive and industrial applications.
The new equipment will have higher degrees of versatility and upgradeability.
Michael Maher of Defense Advanced Research Projects Agency (DARPA) selected as speaker
DE-STA-CO's booth at PACK EXPO next week will include a wide range of its most innovative, efficient workholding tools, but what is under the tools may be equally interesting for attendees. That's because DE-STA-CO is mounting the equipment on top of two of its yet-to-be-released rotary indexers, providing a sneak peek of future products.
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Factory Automation - Featured Product
The BLE2 Series replaces our popular BLE Series and continues our brushless motor advantages by featuring an all new compact, high-power and high-efficiency brushless DC motor combined with a Driver that can be digitally set and controlled via external DC voltage or by the front panel. The BLE2 Series can easily compete with larger 3-phase inverter driven motors in many more applications, with built-in simple holding torque function, saving space and increasing performance thanks to the advantages of a brushless motor design. The BLE2 Series has a maximum speed of 4000 r/min, achieving a speed ratio of 1:50 (80 to 4000 r/min). The new motor structure is small than previous models and enables high power and high efficiency while incorporating easy setting, installation and wiring. The new motor connector offers IP66 degree of protection and allows for easy and direct connection between motor and driver with two available orientation of cable outlet direction. Standardized use of stain