New 6-Slot MicroTCA.4 Chassis Features High Performance Density in 2U Height

VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers a 2U chassis platform that complies to the MicroTCA.4 specification for High Energy Physics and other applications requiring rear IO. The rear IO capability is an attractive option in many Mil/Aero, Physics, Broadcast, Energy, and Network Security designs.

TURCK's New Passive Junction Boxes Simplify Device Integration

Stainless steel ports allow integration of multiple devices to a single unit, even in harsh environments

Global Suppliers of Plasma Cutting Systems, Machitech Automation and EZ Cut CNC, Announce Partnership

Global suppliers of plasma cutting systems, EZ Cut CNC and Machitech Automation, announced a recent partnership. This partnership will allow both companies to expand into new markets.

SME to Feature Key Manufacturing Technologies, Demonstrations and Speakers at FABTECH

3D printing, lasers, robotics and industry experts to be showcased at FABTECH

New MA3120 Welding Robot Provides Extra Long Reach

Reduces Need for Tracks

Vaccon's New Interchangeable, Maintenance-Free Vacuum Cartridges Replace Multi Stage Pumps

Vaccon's RTM Series of air-operated maintenance-free venturi vacuum cartridges save money by eliminating unnecessary maintenance of multi-stage pumps for manufacturers operating in extreme environments. They directly replace equivalent multi-stage pumps which clog and cause days of downtime each year, allowing manufacturers to resume production quickly.

Sierra-Olympic Launches New Commerce Website for Low-Cost OEM, Security, and Laboratory Thermal IR Imagers

"¢ High-resolution and affordable infrared (IR) thermal cameras are available for easy online purchase.

Pack Expo - Infratab unwraps smartphone sensor tags at Pack Expo

Ensuring freshness of food, pharmaceuticals, and all perishables

Newest TRINAMIC Stepper Motion Control IC with Integrated Motor Drive Delivers 50V / 2A Performance

New Low-Cost Monolithic IC is First to Use Trinamic Patented Technology for Exceptionally Quiet Operation

Waytek, Inc. Introduces New Line of Power Distribution Modules for CAN-BUS Focused Manufacturers

Waytek is proud to announce the addition of Infinitybox, to its broad, in-stock offering of OEM manufacturing electrical components.

Rethink Robotics Introduces Industry-First Robot Positioning System

Unique capability allows Baxter to quickly re-orient itself to work cell changes, saving time and increasing flexibility in dynamic manufacturing environments

VadaTech Releases Xilinx Zynq FPGA with On-board Clock and Jitter Cleaner

VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has announced a FPGA in the Advanced Mezzanine Card (AMC) form factor that utilizes the Xilinx® Zynq® all programmable SoC.

Pack Expo - Intelligrated introduces enhanced robotic mixed-load order fulfillment solutions at PACK EXPO International 2014

Next-generation robotic technology increases product-handling flexibility and load stability to satisfy mixed-load requirements

Pack Expo - PolyOne Highlights Advanced Packaging Technologies at PACK EXPO 2014

PACK EXPO International, one of the most highly regarded packaging exhibitions in the world, is held annually and features the latest innovations and trends in the processing and packaging industry.

Pack Expo - A. Schulman To Feature A Wide Range Of Integrated Solutions Serving The North American Packaging Industry At PACK EXPO International

PACK EXPO International, November 2-5, 2014, in Chicago

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Factory Automation - Featured Product

Nion: Next-level time-of-flight

Nion: Next-level time-of-flight

The new Nion 3D camera advances Time-of-Flight (ToF) technology with exceptional resolution, speed, and industrial robustness. Designed for demanding applications such as logistics, warehousing, industrial automation, and robotics, Nion delivers high-resolution depth data with real-time performance for faster, safer, and more flexible operations. At its core is the 1.2-megapixel Time-of-Flight sensor AF0130 from onsemi's Hyperlux ID family, offering up to four times the resolution of conventional VGA-based ToF cameras and significantly higher data density. Active 940-nm laser illumination ensures accurate and stable measurements in low-light conditions, artificial lighting, and even direct sunlight. With an IP67-rated housing, Nion is built for reliable operation in dusty, wet, and thermally challenging industrial environments. A user-friendly API with IDS peak support and compliance with the GigE Vision standard enable fast integration and flexible deployment in high-resolution 3D applications. The Nion 3D camera is now available from IDS Imaging Development Systems.

Robotics and Automation - Featured Company

Palladyne AI Corp.

Palladyne AI Corp.

Welcome to Palladyne AI, where we unleash the power of robotics with our revolutionary AI software platform for the physical world. In a world where robots are progressing toward human-like adaptability, seamlessly navigating dynamic environments and conquering complex tasks with unparalleled efficiency, Palladyne AI stands as the beacon of innovation toward that future reality. Through our cutting-edge artificial intelligence (AI) software platform, we are redefining the boundaries of robotics. Our goal is simple: Help companies with autonomy in their robotics operations by addressing key challenges of traditional robotic deployments.