Advanced Manufacturing Event Returns to Houston

UBM Canon brings PBS Texas, TexasPack, and other trade shows to NRG Center, October 13-14

Spatial Announces Next Generation 3D Software Development Toolkits - A Unified Portfolio Delivering Increased Capabilities and Robustness

Solving Industry Challenges in More Effective and Efficient Ways

Boston Engineering Receives $500,000 MassVentures Grant to Commercialize its Biologically Inspired Unmanned Underwater Vehicles (UUVs)

"Our vehicle solutions are addressing the need to keep people working in maritime environments out of harm's way and to enhance underwater security, research, maintenance, and other applications"

Sciaky, Inc. to Highlight its New Metal Additive Manufacturing Capabilities at EuroMold

EuroMold takes place September 22-25, 2015 in Dusseldorf, Germany.

Great Rock Development Signs LOI to Acquire Pioneering Autonomous Robotics Company

The target company brings a wealth of experience and knowledge to Great Rock as it is an established leader in the Automation Industry and has the technological reach to target several vertical markets.

F3Expo for Drone Hobbyists Descends on Atlanta's Georgia Dome November 12-15

Drones are making headlines and they're coming to Atlanta! F3Expo is the FPV, Flight, Festival & Expo, a public, all-ages event for drone hobbyists: novices, expert pilots, photographers, tech enthusiasts, racers, retailers and manufacturers.

Indiegogo - Meet Andbot, a Social Robot That Will Change The Way You View Robots, Launches on Indiegogo

Andbot, the CP30-like humanoid robot that can handle daily household activities and protect your home all at the same time. With the flexible down-payment option and Own-A-Robot programs, owning a robot has never been this easy, exclusively on Indiegogo.

Pack Expo - Tekkra Showcases an Innovative Entry-Level Shrink Wrapping and Bundling System at Pack Expo 2015

The modular Triad system from Tekkra delivers rugged, dependable shrink wrapping and bundling technology at an entry-level price and breaks new ground in terms of flexibility. (Tekkra Pack Expo Booth C-3223)

Pack Expo - KLEENLine Introduces a Fast, Quiet and Small Footprint Lane Switch Conveyor at Pack Expo 2015

The latest lane switch solution from KLEENLine breaks new ground in terms of price and performance for multi-lane feeding of cartoners and case packers (KLEENLine Pack Expo Booth C-3621)

Fisher Unitech to Host Solidworks Design Excellence Forum

Fisher Unitech will be showcasing new Solidworks 2016 updates along with other technologies that help the design and manufacturing industry maintain a high level of production at their Design Excellence Forum series.

Volvo: Refuse Truck Driver is Supported by Robot

The purpose of ROAR is to demonstrate how we, in the very near future, will use smart machines to assist with a broad range of activities in society.

More than 50,000 Students Worldwide Use "Game-Changing" Technology to Tackle New FIRST Tech Challenge Game, FIRST RES-Q

5,000+ Teams of Students to Use New Java-Based Android Platform Powered by Qualcomm Snapdragon 410 Processor During 2015/16 Season

OMRON to Acquire U.S. Based Adept Technology

Adds Robotics to Strengthen Industrial Automation Business

maxon motor - Miniature Spindle for Linear Positioning Tasks

The GP 6 S spindle gear is suitable for a wide variety of linear drive solutions.

Teledyne DALSA Introduces Low-cost, Fast GigE Area Scan Cameras for Machine Vision

Genie Nano cameras are suitable for a wide range of inspection applications including intelligent traffic systems (ITS), entertainment, medical, food and beverage inspection, and electronics and printed circuit board (PCB) inspection, among many others.

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Featured Product

US Digital - E4T Miniature Optical Kit Encoder

US Digital - E4T Miniature Optical Kit Encoder

US Digital is pleased to announce the launch of the E4T, their latest series of miniature high performance optical encoders. The E4T series delivers a marked performance increase over similar encoder models and designed to be an enhanced replacement for the E4P encoder series. The E4T utilizes state of the art transmissive optical sensing technology, and incorporates US Digital's own proprietary OptoASIC. Assembly of the E4T is simple and efficient and retains the previous E4P's form factor. Key features of the new E4T include: • Mechanically and Electrically Interchangeable with E4P • Improved Quadrature Signal Strength • 100 kHz Frequency Response • Transmissive Optical Design • Collet Style Push on Optical Disk Design (Patent Pending) • Simple & Efficient Assembly Process As with all of our products the E4T is designed and manufactured in their Vancouver, Washington USA facility and is available for purchase as of December 2014.