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Integrated Packaging Line Flexes Strengths of Texwrap, Quest and Serpa at PACK EXPO 2023
See how ProMach and its 46 brands have the expertise to develop turn-key solutions that span the entire spectrum for your next packaging line.
Mitsubishi Electric Automation, Inc. Debuting New 3D Bin Picking Multi-Robot Demo at PACK EXPO 2023
Join Mitsubishi Electric Automation at the Las Vegas Convention Center from September 11th-13th, 2023 for a first look at a 3D Bin Picking robot demo, perfect for automating packaging processes.
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Featured Product
Heliosâ„¢2 Ray Time-of-Flight Camera Designed for Unmatched Performance in Outdoor Lighting Conditions
The Helios2 Ray camera is powered by Sony's DepthSense IMX556PLR ToF image sensor and is specifically engineered for exceptional performance in challenging outdoor lighting environments. Equipped with 940nm VCSEL laser diodes, the Helios2 Ray generates real-time 3D point clouds, even in direct sunlight, making it suitable for a wide range of outdoor applications. The Helios2 Ray offers the same IP67 and Factory Toughâ„¢ design as the standard Helios2 camera featuring a 640 x 480 depth resolution at distances of up to 8.3 meters and a frame rate of 30 fps.
