PACK EXPO

Show Sponsors

Integrated Packaging Line Flexes Strengths of Texwrap, Quest and Serpa at PACK EXPO 2023

See how ProMach and its 46 brands have the expertise to develop turn-key solutions that span the entire spectrum for your next packaging line.

Mitsubishi Electric Automation, Inc. Debuting New 3D Bin Picking Multi-Robot Demo at PACK EXPO 2023

Join Mitsubishi Electric Automation at the Las Vegas Convention Center from September 11th-13th, 2023 for a first look at a 3D Bin Picking robot demo, perfect for automating packaging processes.

Records 16 to 17 of 17

First | Previous

Featured Product

ElectroCraft's Motion Control for Mobile Robots

ElectroCraft's Motion Control for Mobile Robots

ElectroCraft is showcasing its award-winning mobile robot technology including their powerful and compact wheel drives, high-torque-density brushless DC motors, precision linear actuators as well as servo motor drive technology at a variety of conferences and tradeshows including the Boston Robotics Summit. Robotics Summit is the premier symposium for the sharing of ideas, technology, and market developments for robotic technologies across industries. Beyond a showcase and pitch of product, ElectroCraft is eager to participate in the collaborative discussion of challenges and opportunities that will shape the near and long-term robotic marketplace.

Robotics and Automation - Featured Company

e-con Systems

e-con Systems

Since 2003, e-con Systems® has been designing, developing & manufacturing custom and off-the-shelf OEM camera solutions. Backed by a large in-house team of experts, our cameras are currently embedded in 350+ customer products. So far, we have shipped over 2 million cameras to the USA, Europe, Japan, South Korea, & more. Our portfolio includes MIPI, GMSL, GigE, USB cameras, ToF & Stereo cameras & smart AI cameras. They come with industry-leading features, including low-light performance, HDR, global shutter, LED flicker mitigation, multi-camera synchronization, & IP69K-rated enclosure. e-con Systems® also offers TintE™ - an FPGA-based ISP with all necessary imaging pipeline components. It provides a full ISP pipeline as a turnkey solution, featuring optimized, customizable blocks like debayering, AWB, AE, gamma correction and more. Our powerful partner ecosystem, comprising sensor partners, ISP partners, carrier board partners, & more, enables us to offer end-to-end vision solutions.