New High Speed Interconnect from Amphenol Aerospace Delivers Data Rates Up to 10 Gbps per Pair
Oval Contact System (OCS) features improved signal integrity, increased data rates and a smaller form factor as compared to industry standard quadrax
Sidney, N.Y. February 2013 - Amphenol Aerospace (NASDAQ: APH), a global leader in interconnect technologies, now offers a new high speed, rugged connector capable of delivering data rates up to 10 Gbps per pair. The high density Oval Contact System (OCS) features improved signal integrity via reduced cross talk as well as enhanced attenuation performance as compared to industry standard quadrax.
Designed for high speed applications including, but not limited to 10/40G Ethernet, HDMI/DVI video, 1/2/4/8G Fibre Channel, SATA, Serial RapidIO and PCI Express, the rugged OCS connector is ideal for use in the defense, commercial and industrial markets.
The new high density connectors come in nine insert patterns, the largest of which includes 21 differential pairs in a MIL-DTL-38999 series III shell size of 25. The connectors feature a reduced size and weight with a front release, rear removable contact system for easy repair.
The OCS meets the environmental requirements of MIL-DTL-38999 and uses off-the-shelf Mil Spec backshells. Solder cup, crimp and PCB tail termination contacts are available. Contact and plating materials are consistent with SAE-AS39029.
The OCS withstands a minimum of 500 mating cycles and features an operating temperature range of -65°C to +175°C.
For more information, please visit http://www.amphenol-aerospace.com or e-mail Sandra Ford sford@amphenol-aao.com.
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