Future Innovators Robotics Showcase Goes Prime Time
High school robotics teams from around the country to showcase their creations at PACK EXPO International
Reston, Va.; Sept. 6, 2018 - The Future Innovators Robotics Showcase is back at PACK EXPO International and co-located Healthcare Packaging EXPO (Oct. 14-17, 2018; McCormick Place, Chicago). This year show producer PMMI, The Association for Packaging and Processing Technologies, has matched funds up to $2,000 for each PMMI member company supporting high school robotics teams at the show.
"This is a great opportunity for these bright students from around the country to display their robots and learn how robotics technology applies to the packaging industry," says Stephan Girard, director, education and workforce development, PMMI. "These students are future innovators in our industry, and its important that PMMI demonstrates support for youth engagement opportunities like this one. The show is a great time to bring industry professionals and students together."
Supporting PMMI member companies include:
ï‚§ E-Pak Machinery, Inc.
ï‚§ Massman Automation Designs, LLC
ï‚§ AZO
ï‚§ Pearson Packaging Systems
ï‚§ Rockwell Automation
ï‚§ Rexnord
ï‚§ ADCO Manufacturing
Attendees can see sponsored teams creations in action every day of the show in Upper Lakeside Center, Booth E-6620. Demonstrations begin at 9:00 a.m.
PMMI U offers many opportunities for packaging professionals and students to connect at the show, including The Amazing Packaging Race and an all-new networking and interviewing event, CareerLink @ PACK EXPO. To learn more, visit packexpointernational.com/student-opportunities.
Featured Product
OnLogic Karbon 520 Series of Scalable Rugged Computers
The OnLogic Karbon 520 Series of rugged computers is purpose-built to deliver unwavering performance and reliability in the face of extreme temperatures, vibration, and dynamic power conditions. Powered by the latest Intel® Core™ Ultra processors and validated by MIL-STD-810H testing, the Karbon 520 Series makes it possible to deploy dependable computing for AI at the edge, advanced automation, or critical remote and in-vehicle applications in even the most challenging environments.
