PACK EXPO International and Healthcare Packaging EXPO 2018 is Fast Approaching

The show brings together 2,500 exhibitors and 50,000 attendees (from more than 125 countries) to over 1.2 million net square feet of exhibit space from virtually every vertical market. With so many solutions on display, attendees are sure to find ways to apply new technology, achieve cost-saving efficiencies and boost output in unexpected ways.

Reston, Va.; Sept. 24, 2018 - PACK EXPO International and co-located Healthcare Packaging EXPO (Oct. 14-17, 2018; McCormick Place, Chicago) is indisputably the years most comprehensive packaging event in the world, and its right around the corner. This premier event, produced by PMMI, The Association for Packaging and Processing Technologies, is an opportunity for suppliers and buyers to network and see cutting-edge technology in action.


The show brings together 2,500 exhibitors and 50,000 attendees (from more than 125 countries) to over 1.2 million net square feet of exhibit space from virtually every vertical market. With so many solutions on display, attendees are sure to find ways to apply new technology, achieve cost-saving efficiencies and boost output in unexpected ways.

With so much to see, attendees can make the most of their time by using the "My Show Planner" tool, accessible on both show websites. In addition, downloading the PACK EXPO International mobile app, sponsored by ProMach (S-3538), from either the Apple Store or Google Play, provides floor plans, exhibitor listings, special events, new products and product categories, as well as the ability to plan an agenda, take notes and navigate the show halls.

Show Highlights

Pavilions to look for at the show:
• The PACKage Printing Pavilion (South Hall): the industrys main stage for digitals advantages for short-run, on-demand, cost-effective variable data and personalized packaging.
• The Containers and Materials Pavilion (North Hall): will address the latest innovations in paperboard, glass, metal and plastic. Flexible and resealable packaging options will also be on display as well as innovative containers and sustainable choices. The Showcase of Packaging Innovations®, sponsored by The Dow Chemical Company, will also be featured within this pavilion.
• The Confectionery Pavilion (South Hall): find the newest trends and technologies relating to aeration, batch refining, shaping, cluster production and cooling conveyers here. Sponsored by the National Confectioners Association (NCA).
• The Reusable Packaging Pavilion (Lakeside Upper Hall): a hotspot for reusable products, services and solutions for increasing sustainability across the supply chain. Sponsored by the Reusable Packaging Association (RPA), RPAs Reusable Packaging Learning Center within the pavilion will offer free presentations on case studies and best practices for incorporating reusables.
PACK gives BACK™
PACK gives BACK returns to Chicago in support of PACK EXPO Scholarships, a program for U.S. and Canadian students majoring in packaging and processing. Guests will enjoy pre-show networking with refreshments and appetizers followed by a performance by renowned, Chicago-born stand-up comedian Sebastian Maniscalco. PACK gives BACK is Monday, Oct. 15 with the networking reception beginning at 4:30 p.m. and the performance at 5:30 p.m. Tickets to the fundraiser are $75. Rockwell Automation (N-5701) is the title sponsor and GE Digital (Meeting Room W-187a) is the Gold Sponsor of PMMIs annual benefit. For more information, visit: packexpointernational.com/pack-gives-back.

The Forum at PACK EXPO
Take advantage of free, unique, interactive learning sessions throughout PACK EXPO International. The Forum at PACK EXPO will feature 45-minute open sessions on the latest industry trends by the OpX Leadership Network, World Packaging Organisation, Institute of Packaging Professionals, Contract Packagers Association and PMMI Business Intelligence. Sessions will be interactive, including hands-on activities, small group discussions and Q&A sessions. View session schedule.

The Innovation Stage
On the show floor, the Innovation Stage presents free 30-minute seminars on breakthrough technologies and techniques focused on a wide range of industry-specific solutions. For session and location details, click here to view the schedule.

Packaging & Processing Womens Leadership Network (PPWLN)
Register for the next Packaging & Processing Womens Leadership Network networking breakfast at PACK EXPO International (Tuesday, Oct. 16; 7:30-9:00 a.m.; McCormick Place, Room E-450), where manufacturing executives will weigh-in on the company culture change required to grow womens presence in a male-dominated field, and how the industry as a whole can assist in building a more diversified workforce. Featuring Hugh Roddy, vice president, Global Engineering & Project Management, Chobani, Carol ONeill, group president, Packaging, Barry-Wehmiller, AJ Jorgenson, AVP, Strategic Engagement, The Manufacturing Institute and moderated by Jane Chase, executive director, Institute of Packaging Professionals. Find more information and register here.

The Technology Excellence Awards
These inaugural awards will recognize the most innovative technologies making their PACK EXPO debut. Attendees will be able to vote onsite, on the app or online for their favorite finalists selected in specific market segments.

Industry-specific Lounges
PACK EXPO International attendees can network with peers, gain specialized insights and rest their feet at the shows three industry-specific lounges.
• The Candy Bar Lounge (S-2583) hosted by The National Confectioners Association (NCA) and sponsored by Robert Bosch Confectionary Technology (S-3514)
• The Beverage Cooler Lounge (N-4575) hosted by The International Society of Beverage Technologists (ISBT) and sponsored by Bevcorp, LLC (S-3874)
• The Snack Break Lounge (N-4565) hosted by SNAC International and co-sponsored by Dorner Manufacturing Corporation (N-4936), JLS Automation (N-5342) and Soft Robotics, Inc. (E-7207)
Networking receptions for Snack, Confectionery and Beverage Industry Lounges will take place in their respective locations on Tuesday, Oct. 16, from 3:30-5:00 p.m.

Future Innovators Robotics Showcase
See high school robotics teams from across the country showcase their design, engineering and troubleshooting skills (Sunday, Oct. 14 through Tuesday, Oct. 16; 9 a.m.-5 p.m.; Wednesday, Oct. 17; 9 a.m.-3 p.m.; Booth E-6620).

Clemson University Exhibit
Festo Corporation will sponsor Clemson Universitys "Data-Driven Packaging Design" exhibit (N-4543). The exhibit will provide insight on leveraging data to develop award-winning packaging and includes virtual reality demonstrations, eye tracking and emotional analytics studies. Clemson University offers a renowned packaging science degree program and is home to leading experts on packaging and its effects on people.

Student Opportunities
PACK EXPO International offers programs and activities aimed at getting students excited about careers in packaging.
• The Amazing Packaging Race - In this fun and educational event, teams from colleges and universities in North America race around the PACK EXPO International show floor to complete tasks at the booths of participating exhibitors. Wednesday, Oct. 17; 9:00 a.m.-2:00 p.m., Booth E-350.
• CareerLink @ PACK EXPO - CareerLink, PMMIs online job board, is going live at the show. This is an opportunity for PMMI members and consumer packaged goods (CPG) companies to meet with students and veterans pursuing careers in packaging and processing during one-on-one informational interviews to take place at the show on Monday, Oct. 15 (9:00 a.m.-3:00 p.m.) and Tuesday, Oct. 16 (9:00 a.m.-5:00 p.m.) in Room E-353a. Register.

Healthcare Packaging Reception
Healthcare Packaging Magazine will host a networking reception in their booth (W-300) on Tuesday, Oct. 16, from 3:30-5:00 p.m.

Registration for the show is still $30 until Sept. 28 and is available online. After Sept. 28 the price increases to $100.


About PMMI
PMMI, The Association for Packaging and Processing Technologies, represents more than 800 North American manufacturers and suppliers of equipment, components and materials as well as providers of related equipment and services to the packaging and processing industry. We work to advance a variety of industries by connecting consumer goods companies with manufacturing solutions through the world-class PACK EXPO portfolio of trade shows, leading trade media and a wide range of resources to empower our members. The PACK EXPO trade shows unite the world of packaging and processing to advance the industries they serve: PACK EXPO International, PACK EXPO Las Vegas, Healthcare Packaging EXPO, PACK EXPO East, EXPO PACK México, EXPO PACK Guadalajara and ProFood Tech. PMMI Media Group connects manufacturers to the latest solutions, trends and innovations in packaging and processing year-round through brands including Packaging World, Automation World, Healthcare Packaging, Contract Packaging, ProFood World and OEM. PMMI Business Drivers assist members in pursuing operational excellence through workforce development initiatives, deliver actionable business intelligence on economic, market and industry trends to support members' growth strategies and actively connect the supply chain throughout the year.

Learn more at pmmi.org and packexpo.com and pmmimediagroup.com.

# # #


Featured Product

OnLogic Helix 511 Fanless Intel 12th Gen Edge Computer

OnLogic Helix 511 Fanless Intel 12th Gen Edge Computer

OnLogic's Helix 511 Fanless Edge computer delivers ultra-reliable, fanless computing using Intel® 12th Generation performance hybrid processing. The Helix 511 is a versatile fanless computer capable of powering solutions including advanced automation, light detection and ranging (LiDAR), access control & building automation, or virtually any other IoT or edge gateway functionality needed, with support for 4 simultaneous serial connections. The system is able to reliably operate in temperatures ranging from 0 to 50°C, can accept power input ranging from 12 to 24 Volts, and is Wall, VESA and DIN rail mountable.