See Award-Winning Packaging Designs at The Showcase of Packaging Innovations

Show-floor favorite returns to PACK EXPO Las Vegas and Healthcare Packaging EXPO 2019

Reston, Va.; August 8, 2019 - The Showcase of Packaging Innovations®, sponsored by The Dow Chemical Company, will return to PACK EXPO Las Vegas and co-located Healthcare Packaging EXPO (Sept. 23-25; Las Vegas Convention Center), highlighting top packaging designs from around the globe, according to PACK EXPO producer, PMMI, The Association for Packaging and Processing Technologies.


"Through our sponsorship of The Showcase of Packaging Innovations, we're able to inspire innovation and solutions that keep businesses competitive, and move the industry forward," explains Karen S. Carter, commercial vice president for Dow's North America Packaging and Specialty Plastics business. "Dow prides itself on providing products and solutions that create both value and a competitive advantage and it's an honor to be able to share that with the industry."

The showcase features winning entries from packaging competitions worldwide. The Showcase of Packaging Innovations will take place in the Lower South Hall of the Las Vegas Convention Center, Booth S-6519.

This year's participants include:
ABRE—Brazilian Packaging Association
AIMCAL—Association of International Metallizers, Coaters and Laminators
DOW—The Packaging Innovation Awards
FPA—Flexible Packaging Association
FSEA—Foil and Specialty Effects Association
IMDA—In-Mold Decorating Association
IAE—Instituto Argentino del Envase
IoPP—Institute of Packaging Professionals
ProFood World's Sustainability Excellence in Manufacturing Awards
PPC—Paperboard Packaging Council
The Tube Council
WPO—World Packaging Organisation

"Dow's partnership along with these leading global industry organizations add tremendous value to the attendee and exhibitor experience by supplying a diverse and inspirational showcase," says Laura Thompson, vice president, trade shows, PMMI. "We look forward to seeing the innovations on display this year."

Don't miss this year's PACK EXPO Las Vegas and the co-located Healthcare Packaging EXPO. The event will bring together 30,000 packaging professionals with 2,000 leading industry suppliers over 900,000 net square feet of show floor. Registration, which includes access to both PACK EXPO Las Vegas and Healthcare Packaging EXPO, is $30 through Aug. 30 after which the price increases to $100. For more information and to register online, visit packexpolasvegas.com and hcpelasvegas.com.




About PMMI
PMMI, The Association for Packaging and Processing Technologies, represents more than 850 North American manufacturers and suppliers of equipment, components and materials as well as providers of related equipment and services to the packaging and processing industry. We work to advance a variety of industries by connecting consumer goods companies with manufacturing solutions through the world-class PACK EXPO portfolio of trade shows, leading trade media and a wide range of resources to empower our members. The PACK EXPO trade shows unite the world of packaging and processing to advance the industries they serve: PACK EXPO International, PACK EXPO Las Vegas, Healthcare Packaging EXPO, PACK EXPO East, EXPO PACK México, EXPO PACK Guadalajara and ProFood Tech. PMMI Media Group connects manufacturers to the latest solutions, trends and innovations in packaging and processing year-round through brands including Packaging World, Automation World, Healthcare Packaging, Contract Packaging, ProFood World, Mundo PMMI and OEM. PMMI Business Drivers assist members in pursuing operational excellence through workforce development initiatives, deliver actionable business intelligence on economic, market and industry trends to support members' growth strategies and actively connect the supply chain throughout the year.

Learn more at pmmi.org and packexpo.com and pmmimediagroup.com.

Featured Product

OnLogic Karbon 430 Fanless Rugged Computer The K430

OnLogic Karbon 430 Fanless Rugged Computer The K430

OnLogic Karbon 430 Fanless Rugged Computer The K430 packs the power and advanced IoT capabilities of modern Intel processing into a low profile, highly customizable, rugged fanless system built for the challenges of the IoT Edge. Internal components are protected from dust, debris, chemicals, and moisture thanks to fanless and ventless cooling. The Karbon 430 features an operating temperature range of -40° to 70°C, 9~48 V power input, and zero moving parts, all of which help to ensure a long system lifespan.