Basler releases first camera module for NXP’s i.MX 8M Plus applications processor

As a Preferred Vision Partner, Basler worked jointly with NXP to develop a high-performing vision system for Machine Learning (ML) edge computing applications that leverages the full potential of both the camera module and the SoC.

Ahrensburg, 07 January 2020 - Basler is pleased to announce the release of the first camera module that is matched to the NXP® Semiconductors i.MX 8M Plus applications processor. The NXP i.MX 8M Plus features a dual camera Image Signal Processor (ISP) providing real-time processing for crystal clear images and a neural network accelerator delivering up to 2.3 TOPs for extensive machine learning capabilities. In combination with the new Basler camera modules, the resulting vision system provides the perfect solution for intelligent, vision-based machine learning applications.


Through close cooperation and intensive coordination of all hardware and software components, Basler realized a powerful and cost-optimized vision system that utilizes the full potential of both the camera module and the NXP i.MX 8M Plus. The Basler camera module, an 8 MP dart with BCON for MIPI interface, features a premium 4K sensor with excellent High Dynamic Range (HDR) from On Semiconductor. The image data can be processed smoothly by the i.MX 8M Plus, which is optimized for the HDR feature of the sensor.

In addition to the new camera module, two Add-On Camera Kits coordinated with the SoC complete the solution concept. These Add-On Kits contain all hardware components and the necessary drivers to run the Basler camera module with the NXP i.MX 8M Plus without any programming effort. They are available with the new 8 MP or a 5 MP dart BCON for MIPI camera module. Like all Basler products, these camera modules are ideally suited for complex industrial applications due to their long-term availability, quality and robustness.

"For our customers, the combination of Basler's vision know-how and NXP's processor expertise results in ideal embedded vision solutions for AI applications. The added value lies in the optimal use of the different processor modules of the i.MX 8M Plus, in particular the ISP and the Machine Learning Accelerator," commented Gerrit Fischer, Head of Marketing Module Business at Basler.

"The i.MX 8M Plus opens innovation opportunities for intelligent embedded vision systems," said Martyn Humphries, Vice President and General Manager, i.MX applications processors for consumer and industrial markets at NXP. "Working with Basler, we provide the perfect solution for real-time image processing applications with sophisticated machine learning capabilities."

The NXP i.MX 8M Plus processor with the Basler camera module will be presented today at the NXP booth at the CES in Las Vegas and from February 25 to 27, 2020 at the Basler booth at the embedded world 2020 in Nuremberg, Germany.

Featured Product

3D Vision: Ensenso B now also available as a mono version!

3D Vision: Ensenso B now also available as a mono version!

This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.