OSI LASER DIODE Announces NEW High-Power Laser Fiber Packaging

• The new CVD high power laser fiber packaging will be showcased in OSI Laser Diode's booth # 2029 at SPIE Photonics West, Moscone Center, San Francisco, Feb. 4-6, 2014.

January 7, 2014 - Edison, NJ - OSI Laser Diode, Inc. (LDI), an OSI Systems Company, introduces new packaging options for the CVD High Power Laser line. The innovative and compact package features coaxial cable construction which permits a fiber option for lasers in a much smaller footprint than the standard TO5F housing. LDI's new fiber coaxial packaging is available for 850 nm, 905 nm, and 1550 nm single-chip and stacked devices.


OSI Laser Diode's new high-power fiber laser product packaging is designed for stability and high bandwidth capability. The product is ideal for use in optical sensors, cloud measurement, range finding, and industrial applications. For more information, please visit www.laserdiode.com.

If you're planning to attend SPIE's Photonics West 2014, please plan to visit OSI Laser Diode's booth # 2029 at the Moscone Center, San Francisco, CA from Feb. 4 - 6, 2014.

About the Company: OSI Laser Diode, Inc. (LDI), founded in 1967, is a global leader in laser diode technology, providing advanced optoelectronic products that serve the military/aerospace, telecom/datacom (short and long haul), commercial, industrial, and medical markets.

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