Vision 2014 - Teledyne DALSA to Demonstrate Camera Link HS Camera and Frame Grabber at VISION 2014

Visit Teledyne DALSA at the Vision Show, Booth D 54, Hall 1, Messe Stuttgart, Germany in from November 4-6.

WATERLOO, Ontario - October 21, 2014 - Teledyne DALSA, a Teledyne Technologies company and a global leader in machine vision, announced it will demonstrate its new Camera Link HS™-compatible products at the VISION show from November 4-6 at Messe Stuttgart in Germany. The company will preview its Piranha XL 16k CMOS TDI camera and its Xtium-CLHS PX4 frame grabber in Hall 1, Booth D 54 - these are some of the first products in the industry to take advantage of the AIAs Camera Link HS interface standard.


With CLHS interface, the Piranha XL 16k monochrome camera offers the latest breakthrough in multi-line CMOS technology, delivering unprecedented speed and responsivity with low noise. Employing Teledyne DALSA's advanced CMOS sensor architecture, the camera delivers 125 kHz line rate, with incredible responsivity, while maintaining low noise. Exposure control allows seamless operation from stop condition to maximum speed. The Piranha XL 16k delivers 2 GByte/sec data throughput using a single CX4 cable with long transmission distances and cable flexibility.

Senior Product Manager, Xing-Fei He explains, "The Piranha XL 16k camera, combined with the Xtium-CLHS frame grabber offers a complete solution for next generation vision systems such as FPD and PCB inspection. Using Teledyne DALSAs CMOS technology, the camera delivers incredible sensitivity for high speed imaging in light starved conditions."

The Xtium-CLHS PX4 frame grabber is a PCIe Gen 2 frame grabber for high-speed, high-bandwidth cameras that combines reliability and performance with up to 7 CLHS data lanes to capture aggregate data rates of 2.1GB/s. The Xtium series is engineered to meet the ever-increasing image resolution and faster frame rates of todays camera technology. Built on field-proven Xtium technology, this highly reliable and robust frame grabber is extremely cost effective and easy to integrate. The Xtium-CLHS PX4 offers high throughput and is fully backwards compatible with PCIe x4 slots; it also utilizes seamless multi-board synchronization to distribute images across multiple boards for faster processing.

"With the introduction of the Xtium-CLHS board, Teledyne DALSA has expanded the Xtium Series of PCI Express frame grabbers to meet the needs of new high speed CMOS cameras with reliable data capture of 2.1 GB/s in a single cable," said Inder Kohli, Product Manager at Teledyne DALSA. "With its flexible architecture, the Xtium-CLHS serves as an ideal platform for both current copper and emerging fiber optic solutions reaching cables distances beyond 100 meters and will support 3rd party cameras as they are introduced."

Both of these CLHS compatible products target machine vision OEM and are ideal for integration into flat panel, electronics, and semiconductor inspection systems, among other machine vision applications. The Piranha XL multi-line camera and Xtium-CLHS frame grabber are designed to help reduce inspection and manufacturing costs and enable the reliable transfer of information at high speeds without compromise. Visit Teledyne DALSA at the Vision Show, Booth D 54, Hall 1, Messe Stuttgart, Germany in from November 4-6.

Media Note: For product management interview requests, please email geralyn.miller@teledynedalsa.com or visit booth Hall 1, Booth D54 during the VISION show.

About Teledyne DALSA
Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are used in thousands of automated inspection systems around the world and across multiple industries including semiconductor, solar cell, flat panel display, electronics, automotive, medical, packaging and general manufacturing.

An international leader in digital imaging and semiconductors with approximately 1,000 employees worldwide and headquartered in Waterloo Canada, the company designs and manufactures imaging products and solutions, in addition to providing specialized semiconductor products and services.

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