2D cameras for positioning and inspecting ultra-fine wires in semiconductor production

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.

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Featured Product

AUCTION - FACILITY CLOSURE – MAJOR ROBOTICS AUTOMATION COMPANY

AUCTION - FACILITY CLOSURE - MAJOR ROBOTICS AUTOMATION COMPANY

BTM Industrial is a leading asset disposition company assisting manufacturing companies with their surplus asset needs. Founded in 2011, it is a fully licensed-and-regulated, commission-based auction and liquidation company. The company's full asset disposition programs provide customers with the ability to efficiently manage all aspects of their surplus and achieve higher value.

Robotics and Automation - Featured Company

Boston Dynamics

Boston Dynamics

Boston Dynamics is the global leader in developing and deploying highly mobile robots capable of tackling industry's toughest challenges.