2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
OnLogic Karbon 520 Series of Scalable Rugged Computers
The OnLogic Karbon 520 Series of rugged computers is purpose-built to deliver unwavering performance and reliability in the face of extreme temperatures, vibration, and dynamic power conditions. Powered by the latest Intel® Core™ Ultra processors and validated by MIL-STD-810H testing, the Karbon 520 Series makes it possible to deploy dependable computing for AI at the edge, advanced automation, or critical remote and in-vehicle applications in even the most challenging environments.
Robotics and Automation - Featured Company
igus
The mission of igus® is to use its innovative polymer materials to develop products that provide creative solutions and exceed our customers' expectations while delivering fast, accurate service.
