2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
Records 1 to 1 of 1
Featured Product
Harmonic Drive - Coming Soon! Integrated Actuators with EtherCAT
The IDT Series is a family of compact actuators with an integrated servo drive with
CANopen® and, coming soon, EtherCAT. With high torque, exceptional
accuracy and repeatability, these actuators eliminate the need for an external drive and
greatly simplify cabling.
Robotics and Automation - Featured Company
Zimmer Group US, Inc.
Are you interested in premium products in the fields of mechanical and plant engineering? Do you want to learn more about our solutions in the fields of automation, damping, linear, processing, tooling, and machine tooling technology?
