2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Zimmer Group - THE PREMIUM GRIPPER NOW WITH IO-LINK
IO-Link is the first standardized IO technology worldwide for communication from the control system to the lowest level of automation.
Robotics and Automation - Featured Company
DESTACO
DESTACO is now the worldwide leader in the innovation, design, manufacture and support of clamping, gripping, transferring, indexing and robotic tooling solutions for workplace and automation needs.
