2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Onward Robotics - Meet Me Fulfillment Automation
Meet Me uniquely brings talent and technology together: providing end-to-end process efficiency and enabling accurate and continuous fulfillment workflows. Proprietary Pyxis technology uniquely orchestrates picker and Lumabot AMR workflows independently, delivering fast, accurate, and efficient fulfillment from induction to pack out. Learn more about Meet Me Automation: Download Overview Brochure
Robotics and Automation - Featured Company
US Digital
US Digital's breadth of quality motion control products offers a range of sizes and CPRs, delivering the position accuracy you demand. With over 1 million off-the-shelf configurations, including custom designs and manufacturing, we put ultimate precision into your application. US Digital has delivered quality in motion since 1980. Located in Vancouver, WA, the vertically integrated facility and the stellar service team offer shorter lead times, with same-day fulfillment on most orders.
