2D cameras for positioning and inspecting ultra-fine wires in semiconductor production

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.

Records 1 to 1 of 1

Featured Product

Discover how human-robot collaboration can take flexibility to new heights!

Discover how human-robot collaboration can take flexibility to new heights!

Humans and robots can now share tasks - and this new partnership is on the verge of revolutionizing the production line. Today's drivers like data-driven services, decreasing product lifetimes and the need for product differentiation are putting flexibility paramount, and no technology is better suited to meet these needs than the Omron TM Series Collaborative Robot. With force feedback, collision detection technology and an intuitive, hand-guided teaching mechanism, the TM Series cobot is designed to work in immediate proximity to a human worker and is easier than ever to train on new tasks.