2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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DualMove Pallet System Utilizes Timing Belt for Precise Robotic Integration
Our highly advanced DualMove Pallet System for assembly automation is ideal for increasing the efficiency, generation, and precision of pallet traffic. Additionally, it reduces downtime costs that could disrupt production. DualMove is designed to work with the precision timing that robotic integration requires to be successful.
