2D cameras for positioning and inspecting ultra-fine wires in semiconductor production

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.

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OnLogic Helix 401 Fanless Hybrid-Core Computer

OnLogic Helix 401 Fanless Hybrid-Core Computer

OnLogic's Helix 401 Compact Fanless Computer offers scalable, high-performance processing and can simultaneously drive multiple 4K displays, making it the ideal computing platform for many automation and IIoT applications. The Helix 401 has the horsepower to drive mission-critical applications while requiring less than 28W of power, and is small enough to fit in space-constrained locations or enclosures. It can be configured with a range of Intel® 12th generation processors, up to a Core i7 and has Intel Iris® Xe graphics onboard.