Additive Manufacturing/3D Printing Advancements Spotlighted at Chicago Event
RadTech, the non profit for the advancement of UV technologies is sponsoring a unique Additive Manufacturing/3d Printing conference.
Bethesda, MD - April 14, 2014 - Photopolymer Additive Manufacturing/3D
digital data by successively curing a liquid resin by exposure to
ultraviolet light. The technology is widely used for model verification,
functional testing, and the direct manufacture of parts due to its accuracy,
speed and process versatility. It serves many industries including service
bureaus, consumer products, automotive, medical/dental, electronics,
motorsports, aerospace, architectural, as well as academic and
government/military applications.
A unique conference dedicated to advancements in ultraviolet (UV) processing
materials and technology is scheduled for May 12-14 in Chicago. The
conference will review the history of photopolymers in Additive
Manufacturing/3D Printing, describe the physical properties of liquid and
cured UV formulations; introduce emerging innovations and materials; and
discuss current applications and the exciting potential for future uses. UV
curable formulations are uniquely suited for use in additive
manufacturing/3D Printing due to their near instantaneous cure, range of
properties, and dimensional accuracy.
The event will also spotlight Design Enabled by UV + EB Technology, with a
session on Empowering Design & Product Development with Additive
Manufacturing; and a special presentation by the President of Made Boards,
developers of clean, customizable windsurfing, kitesurfing and paddle
boards, to discuss his groundbreaking work in the application of Additive
Manufacturing/3D Printing. RadTech, the non-profit trade association
dedicated to ultraviolet and electron beam (EB) technologies is sponsoring
the cutting edge event, featuring conference programming, short courses and
exhibits: RadTech 2014, Chicago/Rosemont, May 12-14,
http://www.radtech2014.com. The overall UV/EB conference features over 100
speakers including from companies such as Boeing, Nestle, Conforming Matrix,
JMC Steel Group, Motorola, American Trim, Helios, Idex, and many more. For
more information, please visit http://www.radtech2014.com.
Featured Product
3D Vision: Ensenso B now also available as a mono version!
This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.
