Northwire announces Lab 360 program
Northwire's Lab 360 contract manufacturing platform is a customer-focused engineering model that includes six collaborative phases. From concept to completion, Northwire engineers engage with customers through every process phase to ensure their exact requirements are met.
Artila releases PAC-4070 DIN rail programmable automation controller
Artila Electronics released PAC-4070, a DIN-Rail Industrial ARM9 Linux-based Programmable Automation Controller.
Autonomie 'OpenWorld Design Contest' Initiative STMicroelectronics Announces Results of the Autonomie 'OpenWorld Design Contest' Initiative to Promote Human-Assistance Technologies
More than 20 countries participated in the contest to reward the most innovative Human-Assistance Applications
EZ-Robot Manufacturing Upgrades Launched to Meet Rising Demand for Robotics Kit
Responding to skyrocketing product demand, EZ-Robot, provider of the world's most powerful and easy-to-use robotics platform, is pleased to announce its new infrastructure and manufacturing system.
STMicroelectronics Reveals Advanced Wireless Microcontroller to Serve Smart Grid Benefits to Energy Conscious Users
True single-chip microcontroller with industry-standard radio taps into STM32 DNA and latest protocols to speed-up arrival of better energy-saving products
Square pole technology increases productivity in surface grinding up to 200%
This is due to the use of moveable pole extensions which ensure a homogenous, deformation-free clamping
LMI Technologies Signs C&E Sales as Distributor of Gocator All-In-One 3D Smart Sensors
C&E Sales to introduce LMI Technologies' revolutionary Gocator technology to Midwestern US manufacturers looking to improve their factory automation processes
ABB's Dividend Access Facility 2012
The facility also allows them to receive their dividend without deduction of Swiss withholding tax consistent with dividend payments to other shareholders
PARMATECH TO SPEAK ON PROCESS REQUALIFICATION OF MIM-420 STAINLESS STEEL AT MIM2012 CONFERENCE
ATW Companies, a leading provider of custom manufactured metal components and services, announcesthat Greg Goto, senior project engineer of ATW'sParmatech Corporationsubsidiary, will be presenting "Process Re-Qualification of MIM-420 Stainless Steel from Changes in Powder Supply,"at MIM2012
VIA Announces Two New System-on-Module Solutions to the Growing VIA Modular Solutions Portfolio
VIA COMe-8X92 and QSM-8Q90 modules allow for rapid development and application-specific customization
Magnetic Gripper for machine spindles
SCHUNK, the competence leader for clamping technology and gripping systems, has enlarged its module program for machine self-service: Following the finger gripper, vacuum, cleaning, and compensation modules, the GSW-M magnetic gripper is also equipped with a 20 mm shank interface, which clamps in a conventional toolholder, and is also connected with the machine spindle
LMI Technologies Signs C&E Sales as Distributor of Gocator All-In-One 3D Smart Sensors
C&E Sales to introduce LMI Technologies' revolutionary Gocator technology to Midwestern US manufacturers looking to improve their factory automation processes
New Stäubli TP80 Fast Picker: The Next Generation of High Speed Pickers - Setting New Benchmarks for "Pick and Place" Applications
Stäubli Robotics is introducing the TP80 fast picker, a new series of high-speed pickers that deliver greater speeds, up to 200 picks per minute, and more flexibility at a lower cost to the packaging market.
New VALproducts Software : Plug-and-Play Solutions for Complete Robotics Control
Stäubli Robotics has released its newest line of robotics control software: VALproducts. A modular suite of unique, application-specific tools, VALproducts includes VALhsm, VALplast, VALtending and PaintiXen software.
A-T Solutions Announces Partnership With HDT Global
A leader in counterterrorism training for military and law enforcement collaborates with top robotics manufacturer to offer field teams a robotic arm with near-human dexterity
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Featured Product
PI USA - Faster Electro-Optical Wafer Probing
High-density electro-optical PIC wafer probing enables parallel testing of photonic integrated circuits using arrays of mini piezo alignment engines operating simultaneously across a wafer. Each ultracompact aligner delivers nanometer-level positioning and fast, closed-loop optical coupling, enabling simultaneous electrical and optical probing at multiple points. This scalable approach increases throughput, shortens test cycles, reducing cost of test for high-volume PIC and EPIC manufacturing.
Robotics and Automation - Featured Company
e-con Systems
e-con Systems® develops complete embedded vision solutions—including OEM cameras and edge AI compute platforms. With 20+ years of experience and expertise in embedded vision, it focuses on delivering vision and camera solutions to industries such as Robotics, Mobility, Medical and Life Science, Agriculture, Intelligent Transport Systems, Sports Analytics and more. e-con Systems' wide portfolio of products includes MIPI camera modules, GMSL cameras, USB 3.2 cameras, Depth cameras, GigE cameras, HDR cameras, low light cameras, and more. Our cameras are currently embedded in over 350+ customer products, and we have shipped over 2 million cameras to the United States, Europe, Japan, South Korea, and many other countries.
