BitFlow Sponsors Purdue University Hyperloop Team as it Gears Up for Second SpaceX Competition
BitFlow frame grabber used in location finder system
AutoSens returns to AutoWorld in Brussels for the third in its series of world-class events
This third edition of AutoSens will attract a global audience of 400+ technical experts and engineers, attending from disciplines including cameras, LiDAR, radar, image processing, computer vision, in-car networking, testing and validation, certification and standards.
RE2 Robotics Receives Air Force Funding to Develop Robotic Pilot for Autonomous Aircraft
RE2 Robotics announced today that the Company was selected by the Air Force to develop a drop-in robotic system to rapidly convert a variety of traditionally manned aircraft to robotically piloted, autonomous aircraft under the Small Business Innovation Research (SBIR) program.
Military UAV's market to grow at CAGR of 14.89%
SMi reports: Military leaders from the US, Czech Republic and Croatia will discuss the use of UAV for reconnaissance and surveillance at SMi's UAV Technology Central & Eastern Europe
Festo Expands Low Cost EtherNet/IP Connectivity to IO-Link Devices
The Festo CTEU-EP universal EtherNet/IP interface module now includes connectivity to third party IO-Link devices as well as Festo valve terminals.
New: maxon ESCON Module 50/8 HE
The Miniature Servo Controller for Extreme Conditions
Automated painting solution for general industry
Dürr and Kuka introduce jointly developed robot system for the US market
TraceParts gives Engineers the means to easily download CAD models for PCB designs
Engineers can access PCB CAD models from the TraceParts CAD platform and download them in formats compatible with the most common PCB-design tools
ARxIUM Launches Pharmacy 4.0 to Meet Growing Demands of Patient Care and Medication Delivery
First-of-its-Kind Initiative Applies Manufacturing and Supply Chain Industry Advancements to Provide Pharmacies with Several Untapped Benefits
Kaman Measuring Highlights digiVIT and Digital DIT at Sensors Expo and Conference
Kaman Measuring Highlights digiVIT and Digital DIT at Sensors Expo and Conference
Visit Booth #1217 to see IIoT-ready inductive eddy current technology
Middletown, CT - The Measuring Division of Kaman Precision Products, Inc., a world leader in the design and manufacture of high-performance, precision non-contact position measuring systems, announces it will highlight its complete range of inductive eddy current technology at Sensors Expo and Conference, which will be held from June 27-29, 2017 at the McEnery Convention Center, in San Jose, CA, Booth #1217. Stop by the booth to see demonstrations of Kaman's Industrial Internet of Things (IIoT)-ready devices, including the digiVIT Digital Variable Impedance Transducer and new Digital Differential Impedance Transducer (Digital DIT).
Maplesoft Makes Model Based Systems Engineering Accessible to More Engineers with New MapleMBSE
New product helps engineers create, maintain, validate requirements efficiently, with fewer errors
3DR Partners With SoftBank C&S to Offer Site Scan to the AEC Industry in Japan
A perfect fit with Japan's i-Construction mandate, Site Scan will be used to drive productivity for construction and engineering professionals across the country
DENSO Foundation's 2017 Grants Support Hands-On Education at 22 Institutions Across North America
-- Nearly $1 million in grant funding for programs near DENSO communities will help prepare students to join the manufacturing industry's growing skilled trade workforce --
INTEMPORA Unveils RTMaps Embedded. A New Step Further Towards the Development of Autonomous Vehicles
Intempora S.A., editor of RTMaps (Real-Time Multisensor Applications), unveils a new major version called «RTMaps Embedded». RTMaps is a component-based development software which facilitates the design and the execution of advanced driver assistance systems (ADAS) and highly automated driving (HAD) applications.
ReWalk Unveils Soft Suit Exoskeleton for Stroke Patients
"Restore" NextGen Exoskeleton System Developed in Collaboration with Harvard's Wyss Institute
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