IMTS 2014 - Midwest Engineering Systems Exhibiting at IMTS with KUKA Robotics

Midwest Engineering Systems an official KUKA Robotics System Partner will be featured in the Kuka Robotics Corporation booth and display new automation technology.

VDK6000 Robotic Cell for Metal 3D Printing and Metal Part Refurbishing

Flexible Robotics Environment, (FRE) announces the creation of VDK6000 robotic metal 3D printing and repair work cell that automates refurbishing, rebuilding and/or creation of metal components utilizing subtractive and additive technology.

PaR Systems Revolutionizing Friction Stir Welding Process with I-RoboSTIR Solution

PaR Systems, Inc., a world leader in aerospace manufacturing, material handling, automation, and robotic solutions since 1961, announced today that its Shoreview based Automation Solutions Business and its I-STIR Technology, in partnership with FANUC America, are revolutionizing the utilization of the Friction Stir Welding process.

Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification

Protium rapid prototyping platform features flow compatibility with Palladium platform, shortening bring-up time by up to 70 percent versus competitive solutions ----New Protium rapid prototyping platform increases capacity by 4X over the previous generation ---- Palladium XP II verification computing platform now features IEEE 1801 support for improved low-power verification

Sierra-Olympic Introduces Continuous Zoom, Uncooled LWIR Thermal Chassis Camera

The Vinden CZ series is designed as an open-frame chassis camera for integrators and OEMs in industrial, security/surveillance, and military markets.

Klein® Tools Introduces the Switch Drive System

Switch from a handle to a drill in a snap!

New Makers in Store for Fifth Year of Maker Faire Detroit July 26-27 at The Henry Ford

More than 100 new makers to take over Henry Ford Museum for two days of unbridled creativity and fun.

Klein® Tools Adds New Demolition Driver Models

Engineered, manufactured and tested for prying, chiseling and punching.

New Automated Bulk Bag Filling System Streamlines Peanut Processing

The new Spiroflow Systems gain-in-weight bulk bag filling system delivers 15x productivity increase, increases weighing accuracy over 400%, reduces number of operators from nine to one and minimizes possible product contamination.

Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent

Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry.

Bruker Introduces Inspire Nanoscale Chemical Mapping System

System features new PeakForce IR SPM Mode for Comprehensive Nanocharacterization

STRATASYS COMPLETES ACQUISITION OF SOLID CONCEPTS

Stratasys expects to complete its acquisition of Harvest Technologies by the end of July.

Allied Market Research: 3D Printing Market is Expected to Reach $8.6 Billion, Globally, by 2020

The global 3D printing market will reach $8.6 billion by 2020, registering a CAGR of 20.6% from 2014 to 2020.

New Ironless Linear Motor - UXX Series from Tecnotion

The UXX is the most powerful standard ironless motor Tecnotion offers. It is ideal for heavy duty industrial applications that demand ultra-precision and maximum force output.

Inside 3D Printing is Coming to Hong Kong on August 26-27 - Get 10% OFF

Visit www.inside3dprinting.com for further information

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Mobile & Service Robots - Featured Product

Parker LORD MicroStrain Sensing System

Parker LORD MicroStrain Sensing System

The new complete inertial navigation solution comes with GNSS/INS 3DMGQ7 sensor, 3DMRTK correction modem and real time SensorCloud RTK correction network. The sensor comes with Dual antenna GNSS, tactical grade IMU with centimeter-level accuracy with RTK. Low profile and light weight at 78 grams, this sensor is The sensor is optimized for size and weight in Unmanned Ground Vehicles, mobile robots and autonomous vehicles. The network interface 3DMRTK modem is seamlessly integrated into the 3DMGQ7 sensor supports industry-standard NMEA and RTCM 3.1 protocols. The network RTK support comes with cellular data plan. The SensorCloud RTK is a cloud-based RTK correction system with private encrypted data stream. Check out our G Series and C Series OEM products.