2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
BleedIO Tech Launches netMESH Solution
netMESH is a State-of-the-Art Software Solution Based on the BLE Mesh Standard; netMESH Offers a Decentralized, Self-Healing, and Self-Organizing Network, Thus Eliminating Single Points of Failure, Ensuring Continuous Operation Even in the Event of Individual Device Failures
AI Delivers Benefits Today and Tomorrow, According to PMMI Report
AI innovations will be on display at PACK EXPO International 2024
Magnetic Guide Sensor with Angle Measurement Enhances Mobile Robots Path Following
Unlike traditional magnetic line-following sensors that only detect position along a single dimension, the MTS160's unique angle detection allows robots to assess the curvature of the track. This enables the robot to distinguish between minor trajectory adjustments needed on straight paths and more proactive steering for navigating curves.
Innovations and applications of industrial mobile robots
The rapid evolution of factory automation is pushing industries to adopt smarter and more efficient technologies. Among these innovations, industrial mobile robots stand out as game changers. These autonomous machines navigate manufacturing environments, performing critical tasks with precision. This article dives into the latest innovations, applications, and environmental benefits of industrial mobile robots, showcasing how they are revolutionising production lines and driving sustainability in Industry 4.0.
From Palletizing to Case Packing, Brenton Has it All in Booth S-3662 at PACK EXPO International 2024
Add Brenton to your PACK EXPO itinerary to see the engineering expertise of its new RL1000 robotic palletizer and M2000 side load case packer.
ENGINEERING THE AMERICAN DREAM
Building the American Dream: Marcus Schneck, CEO at norelem explains how the company's US expansion will support American design engineers in creating exciting new products.
ZF Pick and place
ZF, a global technology company from Germany, uses the MIRAI AI-vision software to automate a challenging pick-and-place task.
Ultra-Low-Profile Z-Tip-Tilt Nanopositioning Stage Provides Frictionless Motion
Solution for Precision Alignment and Assembly, new from PI
Vention Unveils MachineMotion AI and Announces Collaborations with NVIDIA and ABB at 5th Annual Demo Day
The cloud robotics company also presents new software innovation supporting its mission to democratize industrial automation.
These 7 Emerging Technologies Are Allowing for Fully Automated Warehouses
The idea of a fully automated, "lights-out" warehouse may seem lofty, but today's technology is not far off. Several recent innovations are paving the way for facility-wide automation, and as this trend continues, they could reshape the industry.
RobotLAB Unveils Robotics Innovation Lab in Fort Worth
New Outpost Will Increase Access to Robotics in Tarrant County and Serve as Test Site for Operations, Sales and Marketing Enhancements
Laser Photonics Shares Concept Animation of Next-Gen CleanTech Robotic Cell
Increasingly, enterprises in the industrial sector view worker safety not only as their moral and legal obligation but also as a strategic business decision. Driven by this prioritization of safety, as well as by labor shortages, technological advancements, and the need for customization tools, the robot cell market has been surging.
KSP Fulfillment Partners with Peak Technologies and Locus Robotics to Deploy AMRs in Brooklyn Park, MN Site
KSP has deployed 60 of Locus's innovative and award-winning autonomous mobile robots (AMRs) at its warehouse in Brooklyn Park, Minnesota, with operations initiated in August 2024.
Vention and ABB collaborate to bring cobot automation to small and medium manufacturers
The cloud robotics company welcomes ABB as part of its Manufacturing Automation Platform.
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Factory Automation - Featured Product
3D Vision: Ensenso B now also available as a mono version!
This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.
Robotics and Automation - Featured Company
CMES Robotics Inc.
Powered by AI, CMES Robotics enables 3D vision for factory robots. CMES AI vision software enables robots to recognize unstructured, flexible, or deformed objects, pick them up, and loading and unloading. CMES Vision software has been deployed worldwide for random palletization and depalletization along with void filling applications. CMES Robotics automates your warehouse, logistics, and supply chain.
