Twisting a screwdriver, removing a bottle cap, and peeling a banana are just a few simple tasks that are tricky to pull off single-handedly. Now a new wrist-mounted robot can provide a helping hand - or rather, fingers.
PaR Systems, Inc., a world leader in aerospace manufacturing, material handling, automation, and robotic solutions since 1961, announced today that its Shoreview based Automation Solutions Business and its I-STIR Technology, in partnership with FANUC America, are revolutionizing the utilization of the Friction Stir Welding process.
KW-Software GmbH, a leading provider of automation software technology based in Lemgo, Germany, will change its name to Phoenix Contact Software on January 1, 2015.
The Vinden CZ series is designed as an open-frame chassis camera for integrators and OEMs in industrial, security/surveillance, and military markets.
Switch from a handle to a drill in a snap!
Midwest Engineering Systems is expanding and opening a Engineering office in Wisconsin and a welding and service manufacturing facility in Colorado.
OCTOPUZ.com is designed to provide a focus on simplicity as an ode to the software slogan "Complex Made Simple".
SCHUNK team delivered a brilliant performance at AUTOMATICA 2014
Orange, silver, and gold memberships provide guarantees for predictable cable performance for up to 36 months.
Engineered, manufactured and tested for prying, chiseling and punching.
E-learning modules cover occupational safety, Intelligrated equipment and general maintenance training
Honeywell is using the Seegrid AGVs to transport raw materials such as copper coils, cables, and wire spools to manufacturing and deliver the finished goods to the warehouse.
The new Spiroflow Systems gain-in-weight bulk bag filling system delivers 15x productivity increase, increases weighing accuracy over 400%, reduces number of operators from nine to one and minimizes possible product contamination.
Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent
Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry.
System features new PeakForce IR SPM Mode for Comprehensive Nanocharacterization
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Factory Automation - Featured Product
Advances in AI and deep machine learning have ushered in incredible potential for ground-based, aerial, and maritime robotics. Robotics is moving from an opportunity in business and facility operations to a necessity in many industries. As a result, organizations must plan for multi-vendor robots, intelligent traffic flows, storage, and more.