Indiegogo - Maker Club: The 3D printed home robot revolution is coming.
Tired of 3D printing chess sets? The 'home robot revolution' is coming, according to, Maker Club.
3D Firm Paracosm Attracts $3.3 mln Seed
3D firm Paracosm has closed $3.3 million in seed funding. Atlas Venture led the round with participation from other investors that included iRobot, Osage University Partners, BOLDstart Ventures, New World Angels and Deep Fork Capital.
Pack Expo - Intelligrated introduces enhanced robotic mixed-load order fulfillment solutions at PACK EXPO International 2014
Next-generation robotic technology increases product-handling flexibility and load stability to satisfy mixed-load requirements
OSI LASER DIODE Announces 1550 nm Pulsed Laser Diode with Integrated Micro Lens
• New CVLL 350-CL90 is ideal for field-deployed range finders.
RoboBusiness Takes Boston By Storm
1,000 Professionals Join Together to Invest, Innovate & Implement
Pack Expo - PolyOne Highlights Advanced Packaging Technologies at PACK EXPO 2014
PACK EXPO International, one of the most highly regarded packaging exhibitions in the world, is held annually and features the latest innovations and trends in the processing and packaging industry.
Pack Expo - A. Schulman To Feature A Wide Range Of Integrated Solutions Serving The North American Packaging Industry At PACK EXPO International
PACK EXPO International, November 2-5, 2014, in Chicago
Forbes Names FANUC a Top Global Innovator for the Fourth Consecutive Year
FANUC CORPORATION, the leading manufacturer of CNCs, robots, and ROBOMACHINEs, has been named one of the top 100 innovative companies in the world by Forbes. This is the fourth consecutive year Forbes has named FANUC a top global innovator.
Pack Expo - KUKA Robotics Corporation Chills Out to -30°C at Pack Expo 2014
Discover the new Arctic Series of Palletizing Robots from KUKA Robotics in booth #N-5347 at PACK EXPO Chicago, November 1st - November 5th 2014
Pack Expo - Brother RuggedJet 4 Wi-Fi Mobile Printers to be Showcased by HighJump Software at PACK EXPO 2014
The combined solution will be demonstrated at PACK EXPO 2014, November 2-5 in Chicagos McCormick Place, Booth #9535.
Team MIT-Olin Sails to Victory at RobotX Challenge in Singapore
Team MIT-Olin Sails to Victory at RobotX Challenge in Singapore
XIMEA Unveils Thunderbolt technology in High speed Cameras with IMX174 and CMV20000
XIMEA demonstrates Thunderbolt technology enabled worlds first machine vision cameras with record speeds at the Vision 2014
DATALOGIC Presents Innovative Products and Solutions for Industrial Automation at SPS IPC Drives 2014
Datalogic will showcase bar code readers, machine vision cameras, laser markers, sensors, safety devices, as well as integrated solutions for improving efficiency and accuracy.
Pack Expo - JBT Tackling Tough Industry Issues at PACK EXPO 2014
JBT Tackling Tough Industry Issues at PACK EXPO 2014
Pack Expo - Cambridge Engineered Solutions Highlights Innovative Conveyor Belts for Canning, Bottling and Packaging at Pack Expo
Conveyor belts operating, on display and available for sampling at Booth E-10635 at the Lakeside Lower Hall
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Featured Product
3D Vision: Ensenso B now also available as a mono version!
This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.
