Commercial UAV Expo Announces 2025 Advisory Board
Industry Leaders to Shape Programming and Guide Vision for the Premier Platform for Commercial Drone Innovation
New MVTec HALCON version includes deep learning-based technology for robust bin picking
• Deep 3D Matching as a robust, flexible and fast feature for finding objects in three-dimensional space
• In addition: Numerous improvements and optimizations of already available technologies
• Release on May 27, 2025
BoxLogix Transforms Dot Foods' Cold Order Fulfillment with Advanced Packing Automation
Scalable automation boosts packing speed, accuracy, and efficiency in Dot Foods' cold chain operations.
PI Expands US Manufacturing of Precision Motion Solutions to Navigate Trade Dynamics and Enhance Customer Support
New US production facility scheduled to open in Fall 2025.
Introducing RB-THERON+: the new Mobile Manipulator for industrial applications, warehouses and laboratories
Robotnik's RB-THERON+ is a state-of-the-art autonomous mobile manipulator designed to enhance automation in industrial settings, warehouses, and laboratories. Its compact design allows it to navigate efficiently through narrow hallways, making it ideal for environments with limited space.
Zimmer Group to Unveil AMR at Automate Show
MILES is a complete system that combines hardware, software and servicing - from simulation and goods flow analysis for navigation, to fully automated fleet management including connection to ERP systems for the most in coordinated support in intralogistics processes.
WireCo introduces Lazerlift: The New Generation of Rotation-resistant Hoist Ropes
WireCo introduces Lazerlift: The New Generation of Rotation-resistant Hoist Ropes
How Machine Learning is Transforming Semiconductor Manufacturing Processes
The semiconductor industry, a cornerstone of modern technology, is undergoing a transformation fueled by machine learning (ML) and artificial intelligence (AI). These technologies have become essential in optimizing manufacturing processes, driving efficiency, and ensuring quality. From chip design to defect detection, AI/ML for semiconductors is revolutionizing how we approach production and problem-solving. Central to these advancements is the SECS/GEM protocol, a communication standard that facilitates seamless integration of ML systems into semiconductor manufacturing equipment.
Midwest Motion Products - MMP D33-455F-36V GP81-007
MMP D33-455F-36V GP81-007 (Brushed 36V DC Gearmotor capable of producing up to 28 in-lbs continuous torque and 122 in-lbs peak torque with an output speed of 477 RPM)
Midwest Motion Products - MMP D22-490A -12V GP52-014
MMP D22-490A -12V GP52-014 (Brushed 12V DC Gearmotor capable of producing up to 28 in-lbs continuous torque & 64 in-lbs peak torque with an output speed of 174 RPM. IP54 protected & under 2.5'' diameter & under 8.5'' total length & weight is 4.6 lbs)
Commercial UAV Forum 2026 to Take Place 22-23 April at RAI Amsterdam
New event builds on Commercial UAV brand to serve growing demand for industrial drone technology and collaboration across Europe
DoorDash and Coco Expand Global Partnership with U.S. Sidewalk Robot Delivery Launch
New integration introduces robot deliveries for DoorDash customers in Los Angeles and Chicago
Stäubli Robotics at Automate 2025: Revealing the Methods Behind the Machines
With the theme "We make work easy and safe," the robotics pioneer will demo a variety of automation solutions and offer a look at how it brings ideas into reality
Robotics Leader Stuart "Stu" C. Shepherd and Educational Pioneer Dr. Peter Corke Selected for 2025 Joseph F. Engelberger Robotics Awards
The robotics industry's most prestigious award will be presented May 14, 2025 at Automate in Detroit
Remotely Operated Vehicles (ROV) Exploring the Past and Shaping the Future
In the vast and mysterious realms beneath our oceans, Remotely Operated Vehicles (ROVs) have become indispensable tools, bridging the gap between human ambition and the ocean's depths. These sophisticated machines have revolutionized industries ranging from offshore oil and gas exploration to scientific research and defense. As we look toward the future, the ROV market is poised for significant growth, driven by technological advancements and expanding applications.
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Featured Product
3D Vision: Ensenso B now also available as a mono version!
This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.
