Mouser Receives Top Community Activism Award from ECIA for Support of FIRST Robotics Competition

Mouser received the award at the ECIAs annual executive conference on Oct. 27 in Chicago

Optomec Announces Record System Orders for Its Industrial 3D Printers

100% Growth in Year to Date Bookings

Newest TRINAMIC Stepper Motion Control IC with Integrated Motor Drive Delivers 50V / 2A Performance

New Low-Cost Monolithic IC is First to Use Trinamic Patented Technology for Exceptionally Quiet Operation

PrecisionHawk Announces Addition of Intel Capital to its Series B Investor Group

Intel Capital joins group that includes Millennium Technology Value Partners, Bob Young and The Innovate Indiana Fund to accelerate PrecisionHawks rapid global growth

Waytek, Inc. Introduces New Line of Power Distribution Modules for CAN-BUS Focused Manufacturers

Waytek is proud to announce the addition of Infinitybox, to its broad, in-stock offering of OEM manufacturing electrical components.

Rethink Robotics Introduces Industry-First Robot Positioning System

Unique capability allows Baxter to quickly re-orient itself to work cell changes, saving time and increasing flexibility in dynamic manufacturing environments

Innodisk Showcasing Flash Storage Array at Cloud Computing Expo and Supercomputing '14

Storage Manufacturer to Attend Both Events to Showcase its All-Flash Array and Server Flash Products

Army researchers envision future robots

The U.S. Army is investing in robotics research and development with a vision of increasing autonomy.

VadaTech Releases Xilinx Zynq FPGA with On-board Clock and Jitter Cleaner

VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has announced a FPGA in the Advanced Mezzanine Card (AMC) form factor that utilizes the Xilinx® Zynq® all programmable SoC.

Indiegogo - Maker Club: The 3D printed home robot revolution is coming.

Tired of 3D printing chess sets? The 'home robot revolution' is coming, according to, Maker Club.

3D Firm Paracosm Attracts $3.3 mln Seed

3D firm Paracosm has closed $3.3 million in seed funding. Atlas Venture led the round with participation from other investors that included iRobot, Osage University Partners, BOLDstart Ventures, New World Angels and Deep Fork Capital.

Pack Expo - Intelligrated introduces enhanced robotic mixed-load order fulfillment solutions at PACK EXPO International 2014

Next-generation robotic technology increases product-handling flexibility and load stability to satisfy mixed-load requirements

OSI LASER DIODE Announces 1550 nm Pulsed Laser Diode with Integrated Micro Lens

• New CVLL 350-CL90 is ideal for field-deployed range finders.

RoboBusiness Takes Boston By Storm

1,000 Professionals Join Together to Invest, Innovate & Implement

Pack Expo - PolyOne Highlights Advanced Packaging Technologies at PACK EXPO 2014

PACK EXPO International, one of the most highly regarded packaging exhibitions in the world, is held annually and features the latest innovations and trends in the processing and packaging industry.

Records 5881 to 5895 of 10178

First | Previous | Next | Last

Featured Product

EPC'S NEW 3D Configurator is more than just a fun tool

EPC'S NEW 3D Configurator is more than just a fun tool

EPC is excited to announce our NEW online 3D Configurator. This new tool makes it even easier to configure EPC's products exactly how you need them for your application. The 3D Configurator interface is intuitive and works in any web browser for both desktop and mobile. It'll only take you a moment to learn your way around the program. Careful, though: it's so fun to play with, you may spend a whole afternoon on it!