VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers a 2U chassis platform that complies to the MicroTCA.4 specification for High Energy Physics and other applications requiring rear IO. The rear IO capability is an attractive option in many Mil/Aero, Physics, Broadcast, Energy, and Network Security designs.
Stainless steel ports allow integration of multiple devices to a single unit, even in harsh environments
Global Suppliers of Plasma Cutting Systems, Machitech Automation and EZ Cut CNC, Announce Partnership
Global suppliers of plasma cutting systems, EZ Cut CNC and Machitech Automation, announced a recent partnership. This partnership will allow both companies to expand into new markets.
3D printing, lasers, robotics and industry experts to be showcased at FABTECH
Reduces Need for Tracks
Vaccon's RTM Series of air-operated maintenance-free venturi vacuum cartridges save money by eliminating unnecessary maintenance of multi-stage pumps for manufacturers operating in extreme environments. They directly replace equivalent multi-stage pumps which clog and cause days of downtime each year, allowing manufacturers to resume production quickly.
Sierra-Olympic Launches New Commerce Website for Low-Cost OEM, Security, and Laboratory Thermal IR Imagers
• High-resolution and affordable infrared (IR) thermal cameras are available for easy online purchase.
Ensuring freshness of food, pharmaceuticals, and all perishables
New Low-Cost Monolithic IC is First to Use Trinamic Patented Technology for Exceptionally Quiet Operation
Waytek is proud to announce the addition of Infinitybox, to its broad, in-stock offering of OEM manufacturing electrical components.
Unique capability allows Baxter to quickly re-orient itself to work cell changes, saving time and increasing flexibility in dynamic manufacturing environments
VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has announced a FPGA in the Advanced Mezzanine Card (AMC) form factor that utilizes the Xilinx® Zynq® all programmable SoC.
Pack Expo - Intelligrated introduces enhanced robotic mixed-load order fulfillment solutions at PACK EXPO International 2014
Next-generation robotic technology increases product-handling flexibility and load stability to satisfy mixed-load requirements
PACK EXPO International, one of the most highly regarded packaging exhibitions in the world, is held annually and features the latest innovations and trends in the processing and packaging industry.
Pack Expo - A. Schulman To Feature A Wide Range Of Integrated Solutions Serving The North American Packaging Industry At PACK EXPO International
PACK EXPO International, November 2-5, 2014, in Chicago
Records 1951 to 1965 of 2362
Factory Automation - Featured Product
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