PACK EXPO - Pro Mach Introduces an Advanced Remote Monitoring and Service Technology Optimized for Packaging Lines at Pack Expo Las Vegas 2015
Over ten machines at the show will demonstrate the new smart services initiative. At the same time, more than 20 Pro Mach brands will showcase over 15 new solutions and over 70 machines. Contiguous booths organized by group and application will help attendees quickly find answers to their packaging questions (Pro Mach Booth C-3423)
LimiFrog Leverages New STM32-L4 Processor in Innovative Prototyping Platform
Integrates many features required to implement smart objects - in under 25 grams
PACK EXPO - Intelli-Torq from Closure Systems International Reduces Complaints, Improves Application Consistency
"This capper also makes closure application adjustability, changeovers and maintenance quick and easy"
Robotics Business Review Honors 2015 Game Changer Awards Finalists and Winners
The Game Changer Awards honor both the products and innovators pushing the robotics industry forward in critical areas.
PACK EXPO - Axon Introduces New Remote Monitoring and Remote Service Capability for Its Mandrel-Style Shrink Sleeve Applicators at Pack Expo Las Vegas 2015
ProTech - the new Pro Mach-wide cloud-based monitoring system that provides remote technical service and support along with remote monitoring capabilities to optimize machine performance ̶ is now a standard feature on Axons mandrel-style shrink sleeve applicators (Axon Pack Expo Booth C-2820)
PACK EXPO - Orion Packaging Improves Flex Series Stretch and Pallet Wrappers with Improved Control Package
The new control package features a simplified user interface and will be on display at Pack Expo Las Vegas 2015 (Orion Booth C-3023)
PACK EXPO - ITT Showcases Comprehensive Portfolio of Customized Packaging Industry Solutions at PACK EXPO 2015
PACK EXPO 2015, Sept. 28-30 in Las Vegas, Nev.
PACK EXPO - Videojet Partners with Sun Chemical to Showcase SunLase Laser Marking Solution at Pack Expo 2015
SunLase, at Pack Expo 2015, September 28-30, at the Las Vegas Convention Center.
PACK EXPO - Colordyne Technologies and GoToTags to Debut On-Demand NFC Label Printing at Pack Expo 2015
2015 Pack Expo, Sept. 28-30 at the Las Vegas Convention Center
Job Training Key to American Manufacturing Competitiveness
Turbine Technologies, Ltd. has developed a unique new device called FluidMechatronix. It greatly enhances the state-of-the-art in automated manufacturing training, or mechatronics and is ideally suited for training applications in industry, technical education and engineering programs.
Opto Diode Introduces a Wide Temperature Range Infrared Emitter
Designed for demanding military and industrial markets.
Yaskawa Motoman Introduces Injection Molding Machine Software
Operators can interact and control the robot by using an event-driven paradigm and language that is familiar to them.
PACK EXPO - Rockwell Automation Puts Focus on Smart Manufacturing at PACK EXPO International 2015
Smart machines that thrive in connected manufacturing environments highlighted at Center for Trends and Technology booth
FABTECH 2015 Brings Roaring 3D Scanning Event to Art Institute of Chicago
Beloved lion scanned by Exact Metrology; 3D replicas to be printed by Met-L-Flo Inc. for display at FABTECH 2015
NEXCOM Industrial Firewall Secures Plant Operations with Strengthened Endpoint Protection
NEXCOM's latest industrial firewall platform helps manage security risks associated with Industrial Internet of Things.
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Factory Automation - Featured Product
New incremental encoder IERF3 L from FAULHABER
FAULHABER is expanding its product range with the ultra-precise incremental encoder IERF3 L. Thanks to the optical measuring principle and state-of-the-art chip technology, the device offers the highest resolution, excellent repeatability, and outstanding signal quality. In typical applications, the positioning accuracy is 0.1° and the repeatability 0.007°. This makes the encoder the perfect solution for high-precision positioning applications in confined spaces.
Robotics and Automation - Featured Company
e-con Systems
Since 2003, e-con Systems® has been designing, developing & manufacturing custom and off-the-shelf OEM camera solutions. Backed by a large in-house team of experts, our cameras are currently embedded in 350+ customer products. So far, we have shipped over 2 million cameras to the USA, Europe, Japan, South Korea, & more. Our portfolio includes MIPI, GMSL, GigE, USB cameras, ToF & Stereo cameras & smart AI cameras. They come with industry-leading features, including low-light performance, HDR, global shutter, LED flicker mitigation, multi-camera synchronization, & IP69K-rated enclosure. e-con Systems® also offers TintE™ - an FPGA-based ISP with all necessary imaging pipeline components. It provides a full ISP pipeline as a turnkey solution, featuring optimized, customizable blocks like debayering, AWB, AE, gamma correction and more. Our powerful partner ecosystem, comprising sensor partners, ISP partners, carrier board partners, & more, enables us to offer end-to-end vision solutions.
