Sierra-Olympic Introduces Continuous Zoom, Uncooled LWIR Thermal Chassis Camera
The Vinden CZ series is designed as an open-frame chassis camera for integrators and OEMs in industrial, security/surveillance, and military markets.
Klein® Tools Introduces the Switch Drive System
Switch from a handle to a drill in a snap!
New Makers in Store for Fifth Year of Maker Faire Detroit July 26-27 at The Henry Ford
More than 100 new makers to take over Henry Ford Museum for two days of unbridled creativity and fun.
Klein® Tools Adds New Demolition Driver Models
Engineered, manufactured and tested for prying, chiseling and punching.
New Automated Bulk Bag Filling System Streamlines Peanut Processing
The new Spiroflow Systems gain-in-weight bulk bag filling system delivers 15x productivity increase, increases weighing accuracy over 400%, reduces number of operators from nine to one and minimizes possible product contamination.
Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent
Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry.
Bruker Introduces Inspire Nanoscale Chemical Mapping System
System features new PeakForce IR SPM Mode for Comprehensive Nanocharacterization
STRATASYS COMPLETES ACQUISITION OF SOLID CONCEPTS
Stratasys expects to complete its acquisition of Harvest Technologies by the end of July.
Parallella: $119 Parallel Computing Platform with 16-core Epiphany chip
Parallella Computer Specifications:
The Parallella platform is an open source, energy efficient, high performance, credit-card sized computer based on the Epiphany multicore chips developed by Adapteva. This affordable platform is designed for developing and implementing high performance, parallel processing applications developed to take advantage of the on-board Epiphany chip. The Epiphany 16 or 64 core chips consists of a scalable array of simple RISC processors programmable in C/C++ connected together with a fast on chip network within a single shared memory architecture... ( cont'd )
A realtime raytracing example running on the 16-core Epiphany chip:
Allied Market Research: 3D Printing Market is Expected to Reach $8.6 Billion, Globally, by 2020
The global 3D printing market will reach $8.6 billion by 2020, registering a CAGR of 20.6% from 2014 to 2020.
Raspberry Pi Model B+
From Eben Upton, Raspberry Pi Founder:
This isn’t a “Raspberry Pi 2″, but rather the final evolution of the original Raspberry Pi. Today, I’m very pleased to be able to announce the immediate availability, at $35 – it’s still the same price, of what we’re calling the Raspberry Pi Model B+.
The Model B+ uses the same BCM2835 application processor as the Model B. It runs the same software, and still has 512MB RAM; but James and the team have made the following key improvements:
More GPIO. The GPIO header has grown to 40 pins, while retaining the same pinout for the first 26 pins as the Model B.
More USB. We now have 4 USB 2.0 ports, compared to 2 on the Model B, and better hotplug and overcurrent behaviour.
Micro SD. The old friction-fit SD card socket has been replaced with a much nicer push-push micro SD version.
Lower power consumption. By replacing linear regulators with switching ones we’ve reduced power consumption by between 0.5W and 1W.
Better audio. The audio circuit incorporates a dedicated low-noise power supply.
Neater form factor. We’ve aligned the USB connectors with the board edge, moved composite video onto the 3.5mm jack, and added four squarely-placed mounting holes... ( cont'd )
New Ironless Linear Motor - UXX Series from Tecnotion
The UXX is the most powerful standard ironless motor Tecnotion offers. It is ideal for heavy duty industrial applications that demand ultra-precision and maximum force output.
Inside 3D Printing is Coming to Hong Kong on August 26-27 - Get 10% OFF
Visit www.inside3dprinting.com for further information
HHI Develops New Robotic Welding Process for Building Offshore Facilities
Hyundai Heavy Industries Co., Ltd. (HHI), the world's biggest shipbuilder and a leading offshore facilities contractor, announced today that it developed a new automatic welding process for building offshore facilities.
New Ironless Linear Motor - UXX Series from Tecnotion
The UXX is the most powerful standard ironless motor Tecnotion offers. It is ideal for heavy duty industrial applications that demand ultra-precision and maximum force output. With no cogging and zero attraction force between the coil and the magnets, it is ideal in flat panel and semiconductor applications.
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Personal & Service Robots - Featured Product
Maplesoft - Free Whitepaper: Developing a Robot Model using System-Level Design
This paper uses NAO, the humanoid robot from Aldebaran Systems, to demonstrate how MapleSim can be used to develop a robot model, and how the model can be further analyzed using the symbolic computation engine within Maple.
