Klein® Tools Introduces the Switch Drive System
Switch from a handle to a drill in a snap!
Midwest Engineering Systems Opens Two New Facilities
Midwest Engineering Systems is expanding and opening a Engineering office in Wisconsin and a welding and service manufacturing facility in Colorado.
In-House Solutions launches OCTOPUZ website
OCTOPUZ.com is designed to provide a focus on simplicity as an ode to the software slogan "Complex Made Simple".
SCHUNK wows a full house
SCHUNK team delivered a brilliant performance at AUTOMATICA 2014
igus - Welcome to the Chainflex® Guarantee Program!
Orange, silver, and gold memberships provide guarantees for predictable cable performance for up to 36 months.
Klein® Tools Adds New Demolition Driver Models
Engineered, manufactured and tested for prying, chiseling and punching.
Intelligrated releases I-Campus learning management system
E-learning modules cover occupational safety, Intelligrated equipment and general maintenance training
Honeywell Deploys Seegrid AGV Pallet Trucks for Productivity and Efficiency Gains
Honeywell is using the Seegrid AGVs to transport raw materials such as copper coils, cables, and wire spools to manufacturing and deliver the finished goods to the warehouse.
New Automated Bulk Bag Filling System Streamlines Peanut Processing
The new Spiroflow Systems gain-in-weight bulk bag filling system delivers 15x productivity increase, increases weighing accuracy over 400%, reduces number of operators from nine to one and minimizes possible product contamination.
Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent
Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry.
Bruker Introduces Inspire Nanoscale Chemical Mapping System
System features new PeakForce IR SPM Mode for Comprehensive Nanocharacterization
New ElectroCraft TPP34 TorquePower™ Plus Stepper Motor
This bi-directional 1.8° NEMA size 34 hybrid DC stepping motor provides a lot of torque in a relatively small size.
Multi-Contact's Eric Ast elected president of IPVEA
During Intersolar Europe 2014 in Munich, the International Photovoltaic Equipment Association (IPVEA) elected new members to their board, including Multi-Contacts Eric Ast as their new president.
Rockwell Automation Celebrates 20th Anniversary of Software R&D Campus in Dalian
Rockwell Automation, Inc., the worlds largest company dedicated to industrial automation and information, celebrates the 20th anniversary of its software research and development campus in Dalian.
Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit
Feature-rich, affordable platform enables OEMs to leverage SmartFusion2's lowest power consumption in its class, high reliability capabilities and best-in-class security to build highly differentiated products with significant time to market advantage
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Factory Automation - Featured Product
3D Vision: Ensenso B now also available as a mono version!
This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.
