Data visualization iS the key to smart decisions

mySCADA added some brand new features to its visualization software. Now, mySCADA offers Aggregated data logging, Trend customization, Advanced component library, adding GIS maps directly into the project, Compatibility to even more OPC UA servers and much more.

Intelligrated Lifecycle Support Services highlights comprehensive lineup of assessments at PACK EXPO 2017

Assessments evaluate system condition and identify remedial action to minimize unplanned downtime and improve system performance

Discover Innovative Solutions for Packaging and Palletizing from KUKA Robotics Corporation

KUKA Robotics will showcase new and innovative solutions for palletizing and packaging in booth #C-5208 at PACK EXPO Las Vegas September 25th - September 27th 2017

Discover Innovative Solutions for Packaging and Palletizing from KUKA Robotics Corporation

KUKA Robotics will showcase new and innovative solutions for palletizing and packaging in booth #C-5208 at PACK EXPO Las Vegas September 25th - September 27th 2017

Synapticon at ROBOBusiness 2017 - Global Expansion Course of Embedded Systems Company Reaches China

"The move to Silicon Valley about two years ago was very important and valuable for us to consolidate our fundamental strategy, to observe new technologies and to understand them earlier. We have been able to expand our already existing network in this most innovative region in the world,"

Epson Launches All-in-One SCARA Robot for Simple Applications

Addresses Need for a Cost-Effective and Easy-to-Use Automation Solution

Epson Launches All-in-One SCARA Robot for Simple Applications

Addresses Need for a Cost-Effective and Easy-to-Use Automation Solution

Sky No Longer the Limit with Package Distribution Drone at PACK EXPO Las Vegas

PMMI and Workhorse partner to provide show attendees an exclusive glimpse at advancements in aerial automated delivery systems

Transphorm Partner Yaskawa Electric's New Servo Motor is First to Use Gallium Nitride

Mechatronics Leader Uses High Q+R GaN FETs to Reimagine Servo Motors by Redesigning their Power Electronics Systems

FANUC America Announces Winners of Advanced Automation Challenge 2.0

The challenge requires participating schools to design an automation project that relates to a real-world manufacturing application.

Soft Robotics Releases Development Kit 2.0

The Soft Robotics Development Kit has been expanded and will be featured at PACK EXPO Las Vegas

ABB Pack Expo 2017 exhibit showcases leading edge product advancements that provide the flexibility to quickly adapt to evolving customer preferences

The Collaboration, Simplicity and Digitalization unique to ABB allow manufacturers to efficiently and safely handle multiple product and package variations

Microscan Debuts New Machine Vision Camera at The ASSEMBLY Show 2017

Microscan will run the first public demonstration of the new HAWK series machine vision camera at The ASSEMBLY Show in Rosemont, IL. The new development is poised to significantly exceed its predecessors in speed and power and will complete the Microscan's product line for machine vision.

Novotechnik: Compact Touchless Position Sensors

Novotechnik, U.S. introduces the TFD Series of touchless linear position sensors provide wear-free operation in tight spaces. Maximum sensor dimensions are 40 x 27 x 7 mm thin.

Universal Robots to Exhibit New Scalable Packaging Solutions Addressing Fast-Changing Market at PACK EXPO 2017

Pioneer of collaborative robots showcases new cobot-assisted, mobile and modular tabletop system featuring vision-guided multiple part feeding and kitting with conveyor tracking and case loading/unloading.

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Factory Automation - Featured Product

FAULHABER MICROMO - Impressive accuracy through the latest chip technology

FAULHABER MICROMO - Impressive accuracy through the latest chip technology

With the launch of the IEP3, FAULHABER expands its product line with an incremental encoder which, thanks to the latest chip technology, achieves a very high resolution and accuracy. With a diameter of just 8 mm, the IEP3 is very lightweight and compact yet still offers a resolution of up to 10,000 lines per revolution - made possible by the latest chip technology with high interpolation. In the standard version, the resolution is freely programmable from 1 - 4,096 lines per revolution. Moreover, the chip technology that is used ensures a high positional accuracy of typically 0.3 °m as well as a high repeatability of typically 0.05 °m thanks to accuracy compensation.