Pack Expo - PolyOne Highlights Advanced Packaging Technologies at PACK EXPO 2014
PACK EXPO International, one of the most highly regarded packaging exhibitions in the world, is held annually and features the latest innovations and trends in the processing and packaging industry.
Pack Expo - A. Schulman To Feature A Wide Range Of Integrated Solutions Serving The North American Packaging Industry At PACK EXPO International
PACK EXPO International, November 2-5, 2014, in Chicago
Forbes Names FANUC a Top Global Innovator for the Fourth Consecutive Year
FANUC CORPORATION, the leading manufacturer of CNCs, robots, and ROBOMACHINEs, has been named one of the top 100 innovative companies in the world by Forbes. This is the fourth consecutive year Forbes has named FANUC a top global innovator.
Pack Expo - KUKA Robotics Corporation Chills Out to -30°C at Pack Expo 2014
Discover the new Arctic Series of Palletizing Robots from KUKA Robotics in booth #N-5347 at PACK EXPO Chicago, November 1st - November 5th 2014
Pack Expo - Brother RuggedJet 4 Wi-Fi Mobile Printers to be Showcased by HighJump Software at PACK EXPO 2014
The combined solution will be demonstrated at PACK EXPO 2014, November 2-5 in Chicagos McCormick Place, Booth #9535.
Team MIT-Olin Sails to Victory at RobotX Challenge in Singapore
Team MIT-Olin Sails to Victory at RobotX Challenge in Singapore
XIMEA Unveils Thunderbolt technology in High speed Cameras with IMX174 and CMV20000
XIMEA demonstrates Thunderbolt technology enabled worlds first machine vision cameras with record speeds at the Vision 2014
DATALOGIC Presents Innovative Products and Solutions for Industrial Automation at SPS IPC Drives 2014
Datalogic will showcase bar code readers, machine vision cameras, laser markers, sensors, safety devices, as well as integrated solutions for improving efficiency and accuracy.
Pack Expo - JBT Tackling Tough Industry Issues at PACK EXPO 2014
JBT Tackling Tough Industry Issues at PACK EXPO 2014
Pack Expo - Cambridge Engineered Solutions Highlights Innovative Conveyor Belts for Canning, Bottling and Packaging at Pack Expo
Conveyor belts operating, on display and available for sampling at Booth E-10635 at the Lakeside Lower Hall
Pack Expo - Datalogic Selects PACK EXPO International 2014 as Official Launch for New Products
Datalogic will feature next generation solutions in automated bar code reading and inspection, including their new P-Series smart camera, Matrix 210 Liquid Lens 2D imager, Falcon X3+ mobile computer and the PowerScan PM9500-DK handheld imager at PACK EXPO International
Pack Expo - Universal Robotics Introduces Affordable 3D Vision Package
Spatial Vision Robotics 4.2 at Pack Expo 2014
Telemedicine Robots Bring Expertise to Remote Areas
Sophisticated controls and positioning deliver a lifelike experience to doctor and patient alike.
New Modular 3D Printer, MM1, Announces Open Source Platform and Offers RepRap Upgrade Kit
MakerMex seeks to make 3D printing technology available to everyone with the MM1, recently funded on Kickstarter.
Bimba Manufacturing Announces MythBuster Jamie Hyneman Joining its Product R&D Team
Special Effects Guru to Advise Company on Strategic Development
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Featured Product
3D Vision: Ensenso B now also available as a mono version!
This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.
Robotics and Automation - Featured Company
Palladyne AI Corp.
Welcome to Palladyne AI, where we unleash the power of robotics with our revolutionary AI software platform for the physical world. In a world where robots are progressing toward human-like adaptability, seamlessly navigating dynamic environments and conquering complex tasks with unparalleled efficiency, Palladyne AI stands as the beacon of innovation toward that future reality. Through our cutting-edge artificial intelligence (AI) software platform, we are redefining the boundaries of robotics. Our goal is simple: Help companies with autonomy in their robotics operations by addressing key challenges of traditional robotic deployments.
