Switch from a handle to a drill in a snap!
More than 100 new makers to take over Henry Ford Museum for two days of unbridled creativity and fun.
Engineered, manufactured and tested for prying, chiseling and punching.
The new Spiroflow Systems gain-in-weight bulk bag filling system delivers 15x productivity increase, increases weighing accuracy over 400%, reduces number of operators from nine to one and minimizes possible product contamination.
Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent
Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry.
System features new PeakForce IR SPM Mode for Comprehensive Nanocharacterization
Stratasys expects to complete its acquisition of Harvest Technologies by the end of July.
Parallella Computer Specifications: The Parallella platform is an open source, energy efficient, high performance, credit-card sized computer based on the Epiphany multicore chips developed by Adapteva. This affordable platform is designed for developing and implementing high performance, parallel processing applications developed to take advantage of the on-board Epiphany chip. The Epiphany 16 or 64 core chips consists of a scalable array of simple RISC processors programmable in C/C++ connected together with a fast on chip network within a single shared memory architecture... ( cont'd ) A realtime raytracing example running on the 16-core Epiphany chip:
The global 3D printing market will reach $8.6 billion by 2020, registering a CAGR of 20.6% from 2014 to 2020.
From Eben Upton, Raspberry Pi Founder: This isn’t a “Raspberry Pi 2″, but rather the final evolution of the original Raspberry Pi. Today, I’m very pleased to be able to announce the immediate availability, at $35 – it’s still the same price, of what we’re calling the Raspberry Pi Model B+. The Model B+ uses the same BCM2835 application processor as the Model B. It runs the same software, and still has 512MB RAM; but James and the team have made the following key improvements: More GPIO. The GPIO header has grown to 40 pins, while retaining the same pinout for the first 26 pins as the Model B. More USB. We now have 4 USB 2.0 ports, compared to 2 on the Model B, and better hotplug and overcurrent behaviour. Micro SD. The old friction-fit SD card socket has been replaced with a much nicer push-push micro SD version. Lower power consumption. By replacing linear regulators with switching ones we’ve reduced power consumption by between 0.5W and 1W. Better audio. The audio circuit incorporates a dedicated low-noise power supply. Neater form factor. We’ve aligned the USB connectors with the board edge, moved composite video onto the 3.5mm jack, and added four squarely-placed mounting holes... ( cont'd )
The UXX is the most powerful standard ironless motor Tecnotion offers. It is ideal for heavy duty industrial applications that demand ultra-precision and maximum force output.
Visit www.inside3dprinting.com for further information
Hyundai Heavy Industries Co., Ltd. (HHI), the worlds biggest shipbuilder and a leading offshore facilities contractor, announced today that it developed a new automatic welding process for building offshore facilities.
The UXX is the most powerful standard ironless motor Tecnotion offers. It is ideal for heavy duty industrial applications that demand ultra-precision and maximum force output. With no cogging and zero attraction force between the coil and the magnets, it is ideal in flat panel and semiconductor applications.
New InSight® DS+™ delivers >1.2 W output power with >600 nm tuning range, <120 fs pulses
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Mobile & Service Robots - Featured Product
The C-series high performing inertial sensor package provides an OEM form-factor that is optimized for size and weight in Off Highway, Unmanned Ground Vehicles/Mobile Robots and Unmanned Aerial Systems. It's compact and low-profile anodized aluminum housing can be connected directly to a printed circuit board using a UART header or a Samtec FFSD ribbon cable and 2-56 fasteners.